Electronics Forum | Fri Aug 08 11:37:09 EDT 2008 | pjc
Yes, sure. In fact in some applications ICT is coming back. Mainly due to the fact that more and more SMT discrete components have no markings, so AOI cannot tell you if you have the correct value on the PCB. Fixed pin or flying probe ICT is a valuab
Electronics Forum | Sun Sep 09 23:28:08 EDT 2007 | grantp
Hi, We are looking for a supplier for bed of nails test jigs. We have a supplier we currently use, however they are always weeks late, so we really need someone else. Does anyone know of good suppliers? Also, does anyone know if you can get test j
Electronics Forum | Tue Apr 18 10:08:51 EDT 2006 | russ
We use materials such as G10, durapol, or FR4. We put a lot of holes in the fixtures so that only enough material is left to support the board during reflow to prevent sag/ warp or whatever. We also try and keep all bot side material in unpopulated
Electronics Forum | Mon Mar 12 08:00:14 EDT 2007 | rgduval
It sounds like you may be thinking of two different test methodologies. What is required? Bare-bard testing, to verify pcb fabrication? Or populated board testing, to verify manufacturing? If it's bare board testing, the fab house should advise a
Electronics Forum | Thu Nov 13 09:27:21 EST 2008 | cisridn
I have tried covering the vias with thermal tape and that did not work. I like the idea of plugging the via with a temporary solder mask. I will try that the next time I build a fixture which should be tomorrow. This is mainly a problem only becau
Electronics Forum | Wed Nov 12 13:00:58 EST 2008 | cisridn
I have to build test fixtures for RF Power transistors. These components generate alot of heat so the PCB is soldered to a baseplate. The problem I am having is that I am getting too much solder flowing thru the via's and flooding the topside of th
Electronics Forum | Mon Jul 12 00:23:02 EDT 2010 | leadthree
I had cracking caps from the ICT and a variation in the length of the probes (due to wear and tear) that press down the PCB. That put lots of mechanical stress on the PCB. So have also a close look at the ICT, or another other test fixtures you use.
Electronics Forum | Fri Apr 29 14:00:40 EDT 2011 | ppcbs
Our company is finishing up a design prototype for an easy to use re-balling fixture. 100% ball attach, and you can re-ball more than one BGA at a time. Initial investment will be in fixture cost, but you will be able to re-ball several chips in ar
Electronics Forum | Thu Nov 14 05:45:51 EST 2002 | Jon O'Connell
Has anyone had experiences of ICT test fixtures actually damaging the PCB boards - typically when they have moved away from HASL finish to OSP. I would also like to hear more about any specific issues seen at ICT for non HASL pcb finishes thanks -
Electronics Forum | Tue Jul 04 16:13:09 EDT 2000 | TOOLMANTIM
HELLO BILL I HAVE SOME QUESTIONS FOR YOU 1:HOW ARE YOU CLEANING YOUR STENCIL 2:ARE YOU SINGLE OR DOUBLE PRINTING. 3:ARE YOU USEING VACUUM FIXTURES OR NOT? HERE ARE SOME OTHER THINGS TO TRY. IF YOU ARE CLEANING YOUR STENCIL OFTEN BECAREFUL OF USEING
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