Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua
I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g
Electronics Forum | Thu Jun 30 03:14:34 EDT 2016 | andrzej
Looks like "black pad" issue. More about this here: http://www.ipc.org/feature-article.aspx?aid=Black-pad Definitly PCB supplier need to improve the process.
Electronics Forum | Mon Aug 29 08:44:57 EDT 2016 | jrrt_williams
As an OEM repiar tech I would run into "Black Pad" on occasion, though mostly on surface mount pads. The only way I could remove the oxidation was to apply water soluble flux and add solder, then wick away the excess. This left me with a suitable s
Electronics Forum | Mon Aug 22 22:40:52 EDT 2016 | twhoo
analysis report is as attached. Pls let me know what you think of the root cause of this issue? Can i conclude this is a black pad at thru hole ring with a root cause of contaminated gold
Electronics Forum | Wed Aug 24 22:11:36 EDT 2016 | davef
I'd guess that "black pad" is not the issue that you need to address, because only 2 of your 5 test points has the problem that we seem to be discussing. I'd expect "black pad" problems to be more wide spread. Something is going on at those two locat
Electronics Forum | Mon Jun 27 11:01:58 EDT 2016 | mufflerbearings
From the pic, it looks like you have a bad board; ENIG process issue. It used to be called black pad for SMT but I'm sure it's the same condition for T/H. Any good electronic lab should be able to id the black stuff. I would also send raw boards bac
Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef
On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you
Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef
ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in
Electronics Forum | Thu May 05 12:31:27 EDT 2005 | russ
Not in this case, these BGAs were lead free and the profile used was for a lead part. I guess I will give you the whole story. These boards were sent to us from a customer to have the BGAs replaced for an unknown to us reason. We removed the parts
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
