Electronics Forum: tg 130 (Page 1 of 2)

delamination test

Electronics Forum | Tue Aug 23 16:57:29 EDT 2005 | HOSS

50% of seeing it in a single pass. The only time we do this is if we have a board off the line that has delaminated. We'll run a sample of boards through bare to confirm that we have a bad batch. Even if we see no failures on the bare boards, we'l

FR4 or CEM3

Electronics Forum | Tue Jun 22 00:09:14 EDT 2010 | leadthree

You should do some testing what temp you really get. Solder will melt 260~300ºC. Back to the initial question, CEM-3 is a bit harder to buy and has not many varieties. Go for FR4, you can go for a higher Tg then the common 130ºC. There is also 140,

Delamination / Measling

Electronics Forum | Sat Dec 13 17:46:27 EST 2008 | ysutariya

If you're military then you're probably just needing standard 130Tg FR4 and tin-lead finish. I would check two things: 1. Bake temperature: Isola recommends 300F for 4 hours to drive moisture out. Lower baking temperatures do not require a linea

delamination test

Electronics Forum | Thu Sep 01 18:53:08 EDT 2005 | Board House

Pr. I agree with some of the above responses. if you are seeing Delam issues with incoming PCB's the following should be check. 1) Check the OEM Print to what Material they are calling out to be manufactured with. 2) If they are calling out for S

Re: temperature range

Electronics Forum | Mon Nov 27 17:44:10 EST 2000 | Dave F

Gawd. Sure FR-4 will meet those conditions. Tg [check the fine SMTnet Archives for discussion on Tg] of FR-4 is 130�F or so. Consider: * Is the delT between Tg and the upper operating [or storage] temperature acceptable for your application? * D

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 12:19:53 EDT 1998 | Earl Moon

| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.

Maximum Time Above Tg for PWB

Electronics Forum | Mon Jan 24 18:04:46 EST 2005 | Dreamsniper

=130�C as per IPC-4104/21 What will happen if I expose the PWB Assembly with components to a temperature of between 135'C to 152'C, which is above Tg, for 1 hour? Will there be delamination or possible damage to my PWB? What about with the rests of

Re: Tg - Glass transition temperature

Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F

Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier

Military Lamina bake-out

Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef

IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian

| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at

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