Electronics Forum | Fri Jul 08 16:35:04 EDT 2005 | Jason Fullerton
"Whether or not you need a toe fillet depends on your application. We have high reliability products where we can't use a QFN over a certain size, regardless of toe fillet. We have other applications where we meet the thermal cycle requirements for a
Electronics Forum | Wed Aug 10 10:41:23 EDT 2005 | patrickbruneel
Bob, Great theory if you're selling SN100C, but I have to disagree that an alloy being 4�C off eutectic will cause cracks. When a solder joint exits the solder wave, there is an immediate drop in temperature of 100�C. so being off 4�C is irrelevant.
Electronics Forum | Wed Aug 24 08:43:45 EDT 2005 | PWH
What kind of problems/defects/process indicators are you having? It is likely that you will have to bite the bullet and get a thermal profiling mole to prove that your selected profiles are subjecting parts to the correct tempertures per part specs.
Electronics Forum | Sat Dec 03 08:15:41 EST 2005 | davef
Welcome Here for articles on developing reflow recipes: * http://www.process-heating.com/CDA/ArticleInformation/features/BNP__Features__Item/0,3156,18454,00.html * http://www.smtinfo.net/Db/_Reflow%20Soldering.html * http://www.smtinfocus.com/proc
Electronics Forum | Tue Jan 03 05:08:50 EST 2006 | Rob
Yes - as they flex less due to their size. I do have the calculations somewhere from my field apps days but it may take some time to find. The problems occuring with the X7R's MU
Electronics Forum | Fri May 12 07:53:40 EDT 2006 | egrice1
Sheldon, Tip life is directly related to temperature, IRON plating thickness on the tip, Alloy composition used and operator technique. High tin contents in lead free alloys attach the tips. Poor wetting and higher melting temperatures cause us
Electronics Forum | Sun Jan 28 13:26:27 EST 2007 | Sweet Old Bob
Okay you CM haters I don't see anything about the design of the board, other than OSP which is strike one. What is the board size? What is the board thickness? Where is the BGA located on the board? What is your ball to pad ratio? What is your aspect
Electronics Forum | Mon Feb 12 09:51:51 EST 2007 | rgduval
From what I see, you have a couple of options... 1. Hand solder the secondary side LED's. This is only a good option if you're going to be at low-ish volumes. Higher volumes tend to necessitate more automation to reduce production costs. However
Electronics Forum | Fri Apr 20 07:54:25 EDT 2007 | Bob R.
I'm in the high reliability (exempt) sector and have thermal cycled hundreds of boards in the past few years. As far as which is more reliable, SnPb or SAC305, my data is similar to what the technical literature is saying, "It Depends". In low stra
Electronics Forum | Thu May 17 19:21:39 EDT 2007 | diesel_1t
We are currently using Oven Rider (ECD) to "verify" just the conduct of the peak temperature; we define which product is the higher runner for this line and then with the settings for this product (already profiled with thermal couples attached to th
