Electronics Forum | Mon Dec 09 09:54:16 EST 2002 | davef
Large copper pours create an unbalanced lay-up that is bad design practice, creating problems in fabrication and assembly. The hatching a previous poster mentioned could be an alternative. Stepping back a bit and wondering, what's the problem? You
Electronics Forum | Tue Jan 30 01:06:51 EST 2018 | dgassier81
Hi, In our shop we've always baked out PCBs and moisture sensitive parts prior to electronic assembly using a gentle ramp rate of 2 degC/minutes going hot (93degC) and same ramp rate going cold (back to room temp). We're trying to outsource that pro
Electronics Forum | Fri May 15 09:07:12 EDT 1998 | Earl Moon
| | I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and event
Electronics Forum | Wed May 06 09:16:51 EDT 1998 | justin medernach
| I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and eventua
Electronics Forum | Mon Dec 27 05:16:17 EST 2021 | jineshjpr
Hi Stephen, Thanks for your response. Since the OSP Finished PCB to be execute in mass volume, almost 3 to 4 weeks (Vacuum Sealed Pack) takes place prior to assemble. Although we are using SnPb 63-37 Type 4 solder paste for this single sided SMD asse
Electronics Forum | Mon Aug 30 14:32:52 EDT 2010 | davef
Steve: Yes, you shall bake prior to thermal cycling. You should be able to download J-033 from JEDEC [ http://www.jedec.org/standards-documents ]. You want "Paragraph 4 Drying." While it's aimed a component parts and not assemblies, J-033 is as goo
Electronics Forum | Wed Jun 17 16:02:09 EDT 2009 | mhunter
Any thoughts on this will be appreciated, thanks in advance for reviewing. This assembly has been processed in our facility by going through a press operation (~ 1731 lbs), then into wave solder. Note the discoloration around the pemnut. The discol
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Mon Jan 12 13:15:18 EST 1998 | Yves Trudell
In general terms, guidelines for moisture sensitive devices (MSDs) say that you shouldn't put a component through reflow after it has reached its exposure limit with respect to moisture absorption. When using an automated hot air rework tool to remo
Electronics Forum | Thu Oct 25 11:29:04 EDT 2007 | ck_the_flip
Forget all the bickering and semantics. EVERYONE IS RIGHT!! ...but then again, in soldering, there IS no right, wrong, or indifferent... just blame. :-) Soldering is, after all, the most difficult process with the most opportunities for defects.
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
