Electronics Forum | Thu Oct 31 01:52:17 EST 2002 | jason
Anybody with experience on such a rework ?? The QFP has thermal pads underneath the body and needs to be re-connected when subjected for rework... Any ideas ???
Electronics Forum | Thu Oct 31 09:34:38 EST 2002 | russ
We do this all of the time, This is what we do but I would be interested in other methods. 1. Remove component with BGA type rework station 2. Wick off lead pads only, verify/create even solder surface on the thermal pad on the board 3. Apply no-cle
Electronics Forum | Thu May 06 18:48:22 EDT 2004 | Dreamsniper
SUMMIT 750. My yield is 75%-98%. And they all depend on the pad design, stencil, paste, operator, thermal profile, etc. I have 98% yield on some of our products with good pad design. Process is easy to control. Dreamy
Electronics Forum | Wed Apr 28 23:05:56 EDT 2004 | FocalSpot
Hi Daniel, I would suggest you check out http://www.focalspot.com. FocalSpot offers an advanced rework station from Japan, the RD-500 Series, which is unique to the industry and tailored for lead free rework and challenging BGA applications due i
Electronics Forum | Mon Mar 16 16:58:51 EDT 2009 | Charlie D
We evaluated several rework machines a few years ago and decided on the Finetech CRS-10. It outperformed the Airvac DRS25 machine. We didn't bring in the Focal Spot because it uses IR. The Focal Spot System does not have a solder removal option and
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef
Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an
Electronics Forum | Tue Dec 30 20:48:31 EST 1997 | Tom Gervascio
Has anyone had any experience with thermal shocking and cracking of SMD capacitors during the rework process? My company was advised to preheat capacitors to 125 C at a rate of 2 C/sec before replacing them onto boards. Would this maybe degrade c
Electronics Forum | Sat Jan 03 18:13:58 EST 1998 | David Jacks
Tom: You are right. Pre-heating is just as necessary in rework as it is in intiial production. Zephyrtronics produces an economical convective bottom side pre-heater known as an airbath. This product ramps the substrate and assembly at 2-4 degrees
Electronics Forum | Wed Dec 31 08:55:09 EST 1997 | justin medernach
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
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