Electronics Forum: thermal conductivity w/m solder mask (Page 1 of 3)

Conductive filled Vias on BGA

Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef

First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled

Affect of Solder Mask on Heat Dissipation

Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef

Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co

Solder wick on Ag/Pd termination

Electronics Forum | Tue Oct 23 07:03:52 EDT 2007 | davef

We're not really sure. Usually when solder leaves the pads and wicks-up a component lead, it means the component lead is much warmer than the pad on the board. This is the direction we would have taken this if we hadn't taken the AgPd / conductive e

White Solder Mask - color not consistent

Electronics Forum | Wed Feb 26 04:28:39 EST 2014 | chongns

Hi All member I have a problem on the stable down the color of the white solder mask PCB. first, i tough the color differences was cause by the solder mask ink, but after a close look, the color change are cause by the copper under the solder mask

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 08:32:21 EDT 1998 | Dave F

| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints

Re: Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 21:25:33 EDT 1998 | John Allan

| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan

| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo

Re: ICT sites under BGAs

Electronics Forum | Wed Aug 09 22:11:46 EDT 2000 | Dave F

Mark: The best routing of test vias for BGAs is to keep them far away from the device. We route test pads for the outer two rows of balls and use vias as test pads for the inner rows of balls. Your bottom-side layout is fine. Yes, on the top-side

Re: Off Pad Printing

Electronics Forum | Tue Jun 29 04:45:10 EDT 1999 | Earl Moon

| | Hey there gang, how's it going ? | | | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my componen

Re: Repair of SMT boards...a question!!

Electronics Forum | Mon Jun 07 10:57:31 EDT 1999 | Dave F

| | | | Where I can find some informations about repairing of SMT boards? | | | | | | | | Thanks | | | | | | | | Marcos | | | | | | | A first place to start is IPC's 7711 and 7721 encompasing repair, modification, and rework procedures. | | | |

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