Electronics Forum | Wed Jan 07 02:08:56 EST 2009 | sachu_70
Hi! Just joined the circuit. Hot Bar soldering is very reliable provided the Flexible Printed Circuit (FPC) and Rigid PCB design support this technique. Some of the critical aspects that need to be considered include Stencil apperture design for sold
Electronics Forum | Fri Jun 04 12:18:48 EDT 1999 | Gary Miller
| | | Any recommendations for a reballer for BGA and mBGA? Low volume, low cost appreciated! | | | | | Dave: I don't believe that reballing BGAs that go into customer products is a good idea. Check with your BGA supplier to determine their recom
Electronics Forum | Thu Jul 09 11:13:00 EDT 1998 | justin medernach
| IS IT BETTER FOR SOLDER PASTE TO SPREAD OUT AS FAR AS POSSIBLE ON BARE COPPER, OR FOR IT TO KEEP THE SHAPE OF THE PRINT? I'VE BEEN DOING SOME SOLDER PASTE EVALUATIONS, AND I'M TRYING TO EVALUATE THE RESULTS. I'M NOT SURE THAT BECAUSE A PASTE MAY
Electronics Forum | Wed Jun 24 16:23:29 EDT 1998 | Justin Medernach
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, Your concer
Electronics Forum | Tue Apr 07 14:37:14 EDT 1998 | Chrys
Be careful about the material you choose. All the materials out there are basically glass-filled epoxy composites, but they are different blends with different fillers. Some of them have carbon in the matrix to make them ESD safe, but it also short
Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef
Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via
Electronics Forum | Thu Sep 09 04:51:19 EDT 2004 | Simon UK
65%), if one failed on the board i replaced all of them, and re-tested and thermally cycled them inline with our spec (-55/+80 Deg/C for 48hrs) this was a nightmare, especially when some cracks were not detected until several weeks later while flying
Electronics Forum | Thu Jan 05 11:23:49 EST 2006 | samir
Grant I'm gonna have to go ahead and sort of disagree with you there. The studies that I've been reading from various BGA Manufacturers have identified insufficient homogenizing / coalescing of the Sn/Pb Paste with the SnAgCu balls. Ball not touchi
Electronics Forum | Mon Jan 16 16:19:22 EST 2006 | davef
Dunno. 4% higher standoff results in 16% higher reliability [�The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability� Banks, Donald R., et al.; Proceedings of the Technical Program - Surface Mount International; September 10-12,
Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane
I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of
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