Electronics Forum | Mon Jan 16 16:19:22 EST 2006 | davef
Dunno. 4% higher standoff results in 16% higher reliability [�The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability� Banks, Donald R., et al.; Proceedings of the Technical Program - Surface Mount International; September 10-12,
Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane
I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of
Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir
Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent
Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef
There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass
Electronics Forum | Wed Apr 20 22:06:32 EDT 2016 | ttheis
With desktop/workstation computers I am of the opinion that they should be left to run 24/7 to avoid thermal cycling daily in order to prolong their life. I have dozens of computers between my home and business and I have had good success with this f
Electronics Forum | Thu Nov 23 11:01:21 EST 2023 | kojotssss
Perform profiling with a product where the LED is placed more than on another products. You get a valuable case with a higher delta T and possible maximum reflow temperature must use, etc. This profile will be used for similar products. You need to o
Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Mon Jan 12 13:15:18 EST 1998 | Yves Trudell
In general terms, guidelines for moisture sensitive devices (MSDs) say that you shouldn't put a component through reflow after it has reached its exposure limit with respect to moisture absorption. When using an automated hot air rework tool to remo
Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Tue Apr 27 16:21:09 EDT 1999 | Chrys Shea
| Another basic soldering question. I notice that lead-free solders have become required for plumbing applications due to legislation. In a local hardware store, I noticed the existence of lead-free solders (based upon tin-copper I think) with a me
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