Electronics Forum | Thu Sep 05 11:05:35 EDT 2019 | SMTA-Tony
There are competitors to REL solder alloys from AIM. Tin-Copper-Nickel-Bismuth alloys (Nihon Superior) are an alternative option which do very well in thermal cycle testing. The reflow profiles required are similar to SAC305 profiles. You may als
Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Fri May 31 10:15:30 EDT 2019 | davef
Major sources of crack in the solder connection after thermal cycling are: * Thermal heating caused by differences in thermal expansion between the board and the component * Lead-free solder is more rigid and brittle than eutectic solder in simila
Electronics Forum | Mon Mar 31 11:10:43 EST 2003 | davef
First, most �thermal shock� recipes are not a reliability test. There is no relationship between the failures seem in these tests and in-use application. These tests show you the failures in these tests. That�s it!!! Second, accelerated life test
Electronics Forum | Wed Sep 29 02:16:37 EDT 2004 | FengAng
Hi all, Our department need to setup a reliability lab. And some equipments are need to purchase. At the first stage, thermal cycling test are going to be imported. If anyone of you have this kind of experience, please don't hesitate to SHARE me h
Electronics Forum | Thu Dec 15 12:10:07 EST 2005 | muse95
It should be the other way around. A Pb BGA ball will fully melt in a Pb free process, but a Pb free BGA ball will not fully melt in a Pb process, which means the Pb from the paste on the board will not fully diffuse through the ball. This leads to
Electronics Forum | Wed Feb 02 20:39:07 EST 2000 | Dave F
AF, Buddy: I know someone "set you up" to ask this question, but: 1 What kind of "thermal excursions" are you interested in? Solder cycles, rework cycles, thermal shock, thermal cycling ... 2 What are you talking about boards, components, assembl
Electronics Forum | Sun Jan 21 16:42:35 EST 2001 | davef
I just can not get over the size of these crystals. What is the chronology of and the span of the thermal cycles this BGA has seen.[Just guess at the fabrication cycles, if it's difficult to determine]
Electronics Forum | Fri Jan 27 07:30:54 EST 2012 | scottp
We're in the high rel market and use a lot of 5 mil stencils. They give plenty of paste to meet IPC class 3 and survive over 1000 cycles of -40/+125C thermal cycle testing.
Electronics Forum | Wed Sep 29 06:20:14 EDT 2004 | Peppe
FengAng, I'm involved in similar activities on telecom products and we use as reference: MIL-STD-883E, JESD22, IEC-749. We have 2 climatic chamber to arrange a wide range of test, depending on customer use and/or specs. Based on that experience, we p
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