Electronics Forum: thermal cycles (Page 5 of 34)

How to avoid tombstoning in 0201 components

Electronics Forum | Fri Jul 29 19:12:30 EDT 2005 | Jason Fullerton

In the true sense of the term, tombstoning can only occur during reflow. Now, if your solder joints are cracking during thermal cycling and opening on one end you still have a problem - it just isn't "tombstoning". What laminate are you using on yo

CTE mismatch

Electronics Forum | Thu Sep 14 14:37:45 EDT 2000 | Serrena Carter

Does anyone know where I can find good rule of thumb information on soldering/brazing. I am most interested learning the maximum recommended CTE mismatch between two different materials that thermally cycle between 25-100C.

TSOP Encapsulation

Electronics Forum | Tue Mar 31 08:08:32 EST 1998 | Michael Mallery

I am looking for information on TSOP encapsulating materials. Also, any manufacturing companies that sell TSOP's daisy chained for electrical functional thermal cycling.

Conformal Coating BGA's

Electronics Forum | Fri Jan 14 17:09:21 EST 2005 | Bob R.

Whether or not conformal coating creates a reliability problem if it bridges the gap between the board and bottom of the part depends on the properties of the coating. A low modulus coating is fine, but one thats modulus increases at colder temperat

How to avoid tombstoning in 0201 components

Electronics Forum | Tue Jul 05 15:21:46 EDT 2005 | russ

So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joints)? Must be quite the test! Tell us what pad sizing and spacing you are currently using.

BGA ball Separation

Electronics Forum | Mon Dec 05 12:41:40 EST 2005 | stepheniii

thermal cycling chemical reactions (can occur slowly) they were only touching before and not really a solid solder joint

Tin Lead BGAs in leadfree paste

Electronics Forum | Tue Mar 07 20:48:59 EST 2006 | rbodmer

Craig. i spoke with a process engineer today and he told me that if you mix pb and non pb it may work but may cause premature failures if in a thermal cycleing environment. failure cause may be micro fractures.

Hybrid Profile

Electronics Forum | Tue Apr 18 03:40:05 EDT 2006 | Slaine

Did you try tensile testing after thermal cycling? If there are any intermetalic problems between the two alloys this should show it.

ECA

Electronics Forum | Tue Oct 10 09:39:14 EDT 2006 | blnorman

Does anyone have experience with electrically conductive adhesives? We're looking to try one (don't know whose), but I'm concerned with degradation of the adhesive over time or thermal cycling. Any success or horror stories would be appreciated.

TCE mismatch

Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill

What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.


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