Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Fri May 15 16:21:25 EDT 1998 | John s
| If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular comp
Electronics Forum | Fri May 15 17:59:31 EDT 1998 | Earl Moon
| | If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular co
Electronics Forum | Thu Jun 05 16:44:19 EDT 2003 | blnorman
The data we have is from an IBM report. Below 100�C the SAC reliability is almost double that of SnPb (-40 to 100�C thermal cycle). When the upper end temp is increased to 125�C the reliability drops to 75% of SnPb. I'd like to see the data that s
Electronics Forum | Fri Jul 04 01:32:15 EDT 2003 | rheise
I've seen numerous incidences of mirror image cracking under endcaps in high dielectric material ceramic capacitors due to thermal cycling. If the cracking is deep enough to extent through the plates you can get breakdown and shorting. Section the ca
Electronics Forum | Wed Jul 06 14:36:05 EDT 2005 | Bob R.
The only way we can consistently get a toe fillet is to use a paste with an extremely active flux. We allow that paste on certain products, but discourage it's use because it's on the hairy edge of not meeting our lower limit in surface insulation r
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
Electronics Forum | Tue Feb 29 21:18:00 EST 2000 | Gwen Z
When an assemblied board was on active service, what's the main reason for its failure:the package broken; the mechanics fatigue failure under thermal cycle; the corrosion caused by salt and vapor; the broken chip inside the package etc. I think all
Electronics Forum | Tue Feb 29 21:18:00 EST 2000 | Gwen Z
When an assemblied board was on active service, what's the main reason for its failure:the package broken; the mechanics fatigue failure under thermal cycle; the corrosion caused by salt and vapor; the broken chip inside the package etc. I think all
Electronics Forum | Wed Apr 14 22:39:20 EDT 1999 | Dave F
| Any recommendations for a reballer for BGA and mBGA? Low volume, low cost appreciated! | Dave: I don't believe that reballing BGAs that go into customer products is a good idea. Check with your BGA supplier to determine their recommended maxim
