Electronics Forum | Wed Feb 02 03:32:08 EST 2000 | pascal MATHIEU
emmanuel : i agree with Dave , it's easy to have blind hole on the bottom side , of course in this case you'll lose some thermal efficiency ;the second solution is to put on the bottom side between the board and your heatsink a soft thermal interfac
Electronics Forum | Mon Jul 31 21:33:58 EDT 2006 | seth
What is the distance from the reader to the segment, and can you use a filler gauge to set the gap or is there a special tool needed?
Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef
There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass
Electronics Forum | Fri Mar 29 09:05:16 EDT 2019 | SMTA-Jon
The oil is a carrier for the filler material that actually transfers the thermal energy. Without the oil, the material would just be a powder that would not be easy to apply or keep in place. You should mix the oil back in. Separation of the filler
Electronics Forum | Wed Nov 10 04:51:15 EST 2004 | alanhayllar
That's great - thanks for the advice on the epoxy's. Can anyone provide any info on the single part thermally conductive adhesives or fillers that do not require an activator? Mant thanks.
Electronics Forum | Sat Jan 19 09:30:45 EST 2002 | davef
Yes, you can rework your thermocouples, but consider using a method other than arc welding. Arc welding can join thermocouples, but it uses a filler. The filler adds a third material that affects the slope of the thermal profile. We rework our the
Electronics Forum | Tue Nov 09 16:12:17 EST 2004 | davef
Thermally conductive epoxies are rarely used to hold components in-place. They are more likely used as fillers between two surfaces. Yes, single part glues without an activator are available that are suitable for screen printing or dispensing. Som
Electronics Forum | Wed Jun 08 17:35:04 EDT 2016 | slthomas
We all know that whenever possible, we want thermal relief between the barrel/pad and the copper foil to make it easier to properly solder that through hole connector. My question is, assuming there is no connection from the barrel to a copper layer
Electronics Forum | Sat Jun 06 15:11:17 EDT 2009 | ysutariya
Was this a lead-free capable material that fits into IPC 4101/126 or /129, like an Isola 370HR? I would not be surprised because from the picture I think I can see resin underneath the lifted copper, which is an interlaminate separate. This is a
Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen
We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i
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