Electronics Forum: thermal gasket (Page 1 of 1)

Re: HASL vs. ENIG

Electronics Forum | Thu Dec 14 19:38:28 EST 2000 | Dave F

OK, now let me ask the really dopey question ... so if the irregularity of the HASL surface is punching holes in the thermal gasket and causing shorts to the heat sink, why are you putting solder on that surface? I wonder how the thermal conductivit

Re: HASL vs. ENIG

Electronics Forum | Thu Dec 14 19:32:05 EST 2000 | Dave F

Wow, someone read the fine SMTnet Archives!!!! Scary, get their name!!! [OK, I�ll stop ... Several points are: * Most of the stuff in the fine SMTnet Archives is all the bad things that we can make-up to respond to the questions people ask. Ther

HASL vs. ENIG

Electronics Forum | Thu Dec 14 12:18:01 EST 2000 | genny

Hello all, Our company has always used HASL finish on our products. Recently however, we have a had a problem on a couple of boards that I have been told cannot be avoided with HASL, and we should switch to ENIG(electroless nickel immersion gold).

Flat flexible cable to PCB (RoHS assembly)

Electronics Forum | Thu Dec 28 22:58:30 EST 2006 | davef

If this is same TennRich Type B [ http://www.tennrich.com/trtw/TR_PI_Prod_Info.php?pid=2 ] that is an EMI gasket, it needs to be glued with a conductive adhesive. It has the same thermal capability as a Snickers Bar, about 90*C top end.

Filling via holes during the reflow process

Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef

Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via

Aperture Adjustments and Etch Compensation on Arrays

Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon

As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin

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