Electronics Forum | Fri Aug 03 19:03:32 EDT 2001 | seand
Hello John, What is the key reason requiring that this unknown material be injected from below vs. dispensed prior to placement. Is it an issue with reflow temperatures, effect on placement/thermal expansion? Is this a true requirement or specul
Electronics Forum | Tue Aug 26 21:20:58 EDT 2003 | iman
You may check with the TDS of respective "active parts" IC manufacturers for their recommended no. of thermal cycles permissible in the reflow process. Last I checked 3 cycles for our RF-apps IC was still allowed. For 48pin-QFPs this can be allowed
Electronics Forum | Sat May 27 02:52:20 EDT 2006 | TimS
Gentlemen I have managed to pull myself together after banging my head. I am not sure the flux volume is the total solution here. All spray processes deposit flux in a similar manner, that is to say the vast majority of material sprayed onto the PCB
Electronics Forum | Thu Jul 20 17:01:26 EDT 2000 | Bob Willis
Here is some further information on SDSRS process, but please purchase a copy of the report from t he SMTA as all the money goes to charity. In the UK the SMART Group raised over �3000 for the homeless. SMTA have been raising a lot of money for the G
Electronics Forum | Thu Jul 20 15:08:53 EDT 2000 | Bob Willis
Yes no problem here it is in a nut shell. The sponsor of my CD ROM on this process was Loctite who specifically developed a glue for the process to cure in less than 10seconds. Have a word with these guys they may even have a few CDs. PROCESS SEQUEN
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