Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel
I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the
Electronics Forum | Wed Feb 02 03:32:08 EST 2000 | pascal MATHIEU
emmanuel : i agree with Dave , it's easy to have blind hole on the bottom side , of course in this case you'll lose some thermal efficiency ;the second solution is to put on the bottom side between the board and your heatsink a soft thermal interfac
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Fri Dec 11 09:06:57 EST 1998 | Tom
| Has any body tried reflowing QFP's on both sides of a board. | GCollier Yes we do that quite often, we are using QFP132 with 0.5mm pitch in pure reflow process for both sides (no glue). It works well, the only problems we have seen was wiht compon
Electronics Forum | Fri Dec 11 16:06:18 EST 1998 | Michael Allen
G, You'll find at least one old thread in this Forum on dual-reflow if you do a search. I found one dated April 7, '98 (searched on "reflow"); this particular thread includes a discussion about the maximum weight-to-surface_area for successful dual
Electronics Forum | Thu Aug 13 14:10:01 EDT 2015 | markhoch
Hi Sam, I have a feeling that what you're trying to communicate is that your DPAK's are skewing off the pad during reflow. This is caused by a thermal "mismatch" where the solder paste on one side of the DPAK becomes molten before the other, then th
Electronics Forum | Tue Dec 15 22:23:52 EST 1998 | Erhan Kaya
If that's what you mean, here's what we call them: ROBBER PADS... Pretty close to the "thief" I guess. Those come with the design and if the wave soldering direction is not known at the time of design and/or there's no real estate limitation, the rob
Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan
Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor
Electronics Forum | Mon Dec 07 14:55:41 EST 2015 | clydestrum
So I have an issue coming up that I'm not too sure how to handle. A board was designed with the wrong footprint for a 3-lead transistor in which the single-lead side has a much larger (think thermal pad for qfn) copper land than what is meant for the
Electronics Forum | Fri Jun 16 11:28:53 EDT 2000 | Boca
Solder 'follows' heat. 1. Preheating is a great idea, use a baking oven to get the whole assembly up to temperature, use the preheaters in your wave solder machine (without wave) to preheat the assemblies ... 2. Or use the biggest soldering iron
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