Electronics Forum | Tue Aug 17 09:59:50 EDT 1999 | Earl Moon
I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the adve
Electronics Forum | Fri Aug 20 13:00:16 EDT 1999 | ScottM
| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad
Electronics Forum | Thu Aug 19 22:59:48 EDT 1999 | Jeff Ferry
| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad
Electronics Forum | Thu Aug 19 23:56:49 EDT 1999 | Earl Moon
| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the
Electronics Forum | Fri Aug 20 09:33:51 EDT 1999 | Don Morgenstern
Earl & Jeff Our machine is different than the Electrovert Solder Pak in that it is does not behave like a "volcano". Jeff, please contact me if you have safety concerns as perhaps you also want to consider our equipment. | | I'm trying a second ti
Electronics Forum | Fri Aug 20 14:19:47 EDT 1999 | Earl Moon
| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Tue Jul 29 21:21:41 EDT 2003 | Dean
KIC Thermal Profiling also sells the double - sided aluminum tape. They also did a white paper characterizing the material... Good stuff.
Electronics Forum | Thu Mar 17 22:47:29 EST 2005 | davef
That would be our first guess, also. Get the stuff analyzed to be sure. Another clue is if the white stuff disappears when you hit it with hot air from a rework station. The hot air is activate the flux. Good troubleshooting tool, but you're subj
Electronics Forum | Fri Oct 03 05:59:20 EDT 2014 | cmchoue
Does anyone well know in "via hole design in ground pad" I have few question that i want to know the answer,thanks. 1.Thermal performance compare about a.Via Full Stuff (top/bottom:solder mask and inside is air) b.Via Half Stuff (bottom:solder mask
