Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Thu Oct 31 09:34:38 EST 2002 | russ
We do this all of the time, This is what we do but I would be interested in other methods. 1. Remove component with BGA type rework station 2. Wick off lead pads only, verify/create even solder surface on the thermal pad on the board 3. Apply no-cle
Electronics Forum | Thu Oct 31 01:52:17 EST 2002 | jason
Anybody with experience on such a rework ?? The QFP has thermal pads underneath the body and needs to be re-connected when subjected for rework... Any ideas ???
Electronics Forum | Thu Jun 10 19:20:59 EDT 2021 | kojotssss
Hi, Too much paste on grounding pad. Looks like also doesnt have path for gases, for void escaping.
Electronics Forum | Thu Jan 02 07:04:57 EST 2020 | dontfeedphils
Pretty large solder-ball. Looks like it may have come from the ground pad since it's so large, in which case I would reduce the print coverage on the middle/ground pad and see how it works for you. You verified that these parts have the groundpad a
Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw
Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j
Electronics Forum | Tue Dec 31 02:06:21 EST 2019 | sssamw
Yes, from the picture, it seems the gap between solder pad is very small, easy to have solder ball/solder bridge.
Electronics Forum | Tue Dec 31 01:30:07 EST 2019 | sssamw
Do you have clear pictures show IC soldering and the solder ball? DO you have clear picture show the PCB pad?
Electronics Forum | Sat Feb 06 07:14:40 EST 2021 | agoesfirmanto
Dear Sirs, very sorry being late reply after a year. Thank you very much for your advices, you are absolutely correct after reduce grounding pad size. No more solder ball issue. Thank you very much. highly appreciate all of your supports. Best re
Electronics Forum | Thu Jun 06 15:55:28 EDT 2002 | arzu
I agree with the others and experienced the problem myself this week. Solderballs at the side of the chips. I looked at the board and found that the chip is pressing the paste away too much. This in combination with our quite big pads(and stencilaper
