Electronics Forum: thermal relief for qfps (Page 1 of 2)

Wavesolder for a second PASS

Electronics Forum | Mon Dec 31 08:59:36 EST 2001 | Don Adams

The second pass in the wave is pretty extreme and will probably aggravate the conditions which caused warpage in the first place. Areas to look for problems, The lay up of the boards at fabrication or the materials used can lead to warpage. Work wi

X-ray capabilities needed for Xilinix 1152-ball BGA

Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon

Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef

Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 16:02:37 EST 2001 | dblsixes

In the end, we may have to go to our customer to see if we can get Class 3 relief ... We actually did an experiment by adding a ceramic cap to the top of the part, using a thermal paste to improve the thermal connection. It didn't do much for us ..

Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 13:51:57 EDT 1998 | Dave F

Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, opens

Re: Providing Thermal Relief On Vias/Like A Wagon Wheel??

Electronics Forum | Wed Jun 03 21:40:38 EDT 1998 | Dave F

| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints

Re: Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 14:17:12 EDT 1998 | Earl Moon

| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op

Re: Providing Thermal Relief On Vias/Like A Wagon Wheel??

Electronics Forum | Thu Jun 04 09:25:21 EDT 1998 | Chrys

| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo

Re: Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys

| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 08:32:21 EDT 1998 | Dave F

| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints

  1 2 Next

thermal relief for qfps searches for Companies, Equipment, Machines, Suppliers & Information