Electronics Forum | Tue Dec 28 03:59:06 EST 2010 | riscy00
I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density. Has anyone
Electronics Forum | Mon Dec 09 08:13:06 EST 2002 | MA/NY DDave
Hi Yes it is common to design for more uniform heat transfer during the soldering phase or even during the operation phase. It all depends on how bad the problem is during automated assembly or during usage. The only difficulty is that the designer
Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Wed Jan 21 11:46:39 EST 2004 | pjc
Forced Convection delivers the most efficient thermal transfer.
Electronics Forum | Wed May 07 15:42:11 EDT 2008 | joeherz
We have a need to print (via thermal transfer) labels with heights of
Electronics Forum | Thu Jun 24 14:14:25 EDT 1999 | Chris
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Mon Feb 13 13:19:35 EST 2006 | pjc
ECD's OvenRIDER is the only instrument I know that can measure thermal transfer efficiency of a an oven. I suppose it would work for environmental chambers too. This instrument has thermocouples to measure ambient temp of oven zones and well as hi-ma
Electronics Forum | Wed Nov 30 12:44:54 EST 2005 | ppwlee
Dave, Do you know if such thermal transfer study with CB-100 (or equivalent) is available for review? My customer is pursuing this option and I am curious on how much improvement I would see by specifying a conductive via fill on the board. Rgds, P
Electronics Forum | Mon Oct 30 09:47:56 EST 2006 | pjc
If you are using VOC free flux, then forced convection preheats are better at evaporating the water. That may be why you're getting the "splatter". Plus, forced convection preheaters are most efficient at thermal transfer. See if you can get one to p
Electronics Forum | Thu May 02 16:34:41 EDT 2013 | rway
We use Zebra 2824 for small labels. It's a decent printer and we have been using this style for years. I don't know anything about Brady, but they might be worth looking into.
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