Electronics Forum: thermally induced cracks (Page 1 of 24)

Rework induced thermal shock of SMD capacitors

Electronics Forum | Tue Dec 30 20:48:31 EST 1997 | Tom Gervascio

Has anyone had any experience with thermal shocking and cracking of SMD capacitors during the rework process? My company was advised to preheat capacitors to 125 C at a rate of 2 C/sec before replacing them onto boards. Would this maybe degrade c

detecting BGA micro cracks

Electronics Forum | Thu Feb 11 08:14:41 EST 2010 | scottp

It's OK to have the daisychain done in the interposer rather than the die (and a lot cheaper) but in thermal cycling the parts MUST have representative die. That's where a large part of the CTE mismatch comes from to cause fatigue damage. Thermal c

BGA opens / cracks

Electronics Forum | Sun Feb 04 15:06:20 EST 2007 | Scotty

Profile should have a longer cool soak. Verify as was mentioned all pin/fixture support through out the entire process. Print, Place, pre reflow hand load, post reflow, carriers, ICT, Depanel and FCT. Conformal Coated or Potted? Mylars work well for

detecting BGA micro cracks

Electronics Forum | Mon Feb 08 09:03:49 EST 2010 | woodsmt

Looking for methods for detecting BGA microcracks without cross sectioning. Currently evaluating a new package and will be putting together a thermal stress eval. We would like to perform intermediate inspections for cracks. Once all cycles are don

BGA opens / cracks

Electronics Forum | Sun Feb 25 11:59:33 EST 2007 | stepheniii

Just make sure you keep the half done assemblies in dry storage or do the second reflow within the time dictated by the BGAs MSD rating level. Maybe this time you did the second side with a very short wait because you were anxious about the results

BGA opens / cracks

Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63

Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens

Re: Rework induced thermal shock of SMD capacitors

Electronics Forum | Thu Jan 01 13:04:42 EST 1998 | scott cook

| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe

Re: Rework induced thermal shock of SMD capacitors

Electronics Forum | Wed Dec 31 08:55:09 EST 1997 | justin medernach

| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe

Re: Rework induced thermal shock of SMD capacitors

Electronics Forum | Sun Jan 11 11:28:14 EST 1998 | Bob Willis

Most componnent cracking is mechanicaly produced a guide to causes of capacitor damage is included as a download file on my web page www.bobwillis.co.uk I feel that the supplier is looking to blame some one else. IPC make comment on pre heating chip

Re: Rework induced thermal shock of SMD capacitors

Electronics Forum | Sun Jan 11 11:28:12 EST 1998 | Bob Willis

Most componnent cracking is mechanicaly produced a guide to causes of capacitor damage is included as a download file on my web page www.bobwillis.co.uk I feel that the supplier is looking to blame some one else. IPC make comment on pre heating chip

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