Electronics Forum: thermally induced cracks (Page 2 of 24)

Stress induced during V-score depaneling

Electronics Forum | Mon Jun 13 18:47:56 EDT 2011 | kahrpr

Cracked parts close to the edge on pizza cutters are a common problem. There are a lot of stresses on the board as the blade cuts through the board. Raising the blade height so that the boards are not cut clean through will help. You will have to fi

Stress induced during V-score depaneling

Electronics Forum | Wed Jun 15 14:38:43 EDT 2011 | travishemen

Yes, both pads are the same distance from the edge. I also included a picture of a cracked part. Thanks,

Stress induced during V-score depaneling

Electronics Forum | Wed Jun 15 17:47:48 EDT 2011 | davef

Classic mechanical stress crack pattern. Pretty Try baking your boards for 2 hours at 100*C Minimum spacing between board features and v-score or break away is 30thou.

Stress induced during V-score depaneling

Electronics Forum | Mon Jun 13 13:35:08 EDT 2011 | travishemen

Hello, does anyone have any information on stress induced during V-score depaneling. We are using a machine with a fixed blade on the bottom and a free rotating blade on top driven by a motor. We have had some cracked capacitors on the edge of an a

Re: Rework induced thermal shock of SMD capacitors

Electronics Forum | Sat Jan 03 18:13:58 EST 1998 | David Jacks

Tom: You are right. Pre-heating is just as necessary in rework as it is in intiial production. Zephyrtronics produces an economical convective bottom side pre-heater known as an airbath. This product ramps the substrate and assembly at 2-4 degrees

Re: Cracking in High Voltage Chip Caps

Electronics Forum | Tue May 26 17:29:42 EDT 1998 | Earl Moon

| I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. | We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. U

MLCC crack detection

Electronics Forum | Mon Sep 06 04:42:18 EDT 2004 | KenF

Thx for the replies. Acutally I am doing a process related study to see whether the process (pcb depanelling)can induce crack to an MLCC. After depanelling, I will do a thermal shock on the MLCC based on IEC 384-1, that is, five cycles of 30min at hi

Chip Component Stacking

Electronics Forum | Mon Jun 05 12:30:24 EDT 2017 | deanm

Mike, The dispensable solder paste is ordered separately from the printed paste because it has a higher flux content. I would not feel comfortable mixing liquid flux into the printable paste. Ask your paste vendor if they have a dispensable version.

Cracks on ceramic capacitors.

Electronics Forum | Fri Jul 04 01:32:15 EDT 2003 | rheise

I've seen numerous incidences of mirror image cracking under endcaps in high dielectric material ceramic capacitors due to thermal cycling. If the cracking is deep enough to extent through the plates you can get breakdown and shorting. Section the ca

Re: Cracking Capacitors

Electronics Forum | Tue Sep 08 15:11:26 EDT 1998 | Mike Demos

Rich: In my experience, I have seen three cases of SMT Capacitors cracking: 1. Due to thermal shock when entering the wave solder. Note that these were 1210 package sizes on the wave solder side of the boards. We were able to trace this back to th


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