Electronics Forum | Wed Sep 09 10:02:46 EDT 1998 | Earl Moon
| | | I am in need of possible causes and solutions to capacitors that are failing in the field. | | | Are there issues in our process that need to be | | | checked? | | | Some people said the problems are due to improper | | | storage. Others sa
Electronics Forum | Thu Sep 03 14:09:22 EDT 1998 | Matthew Park
Rich, From my experience, few causes of capacitor cracking are: - mechanical stress caused by pick'n place nozzles and chucks. Try to isolate and find cracked caps before boards go thru reflow or wavsoldering. - thermal stress by reflow pro
Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami
Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture
Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan
I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon
Electronics Forum | Wed May 27 15:00:32 EDT 1998 | Scott Cook
| The question raised by our components engineering group is, is it possible to tell whether these failures are thermally or mechanically induced. The focus of design engineering up until now has been on process. Are our reflow temps ok, are the pa
Electronics Forum | Fri Jun 25 09:18:23 EDT 2010 | flipit
Thanks, Dennis. That is a good idea, but I > have problem :) - our logistic department lookig > for cheap components...What other mnfg of cap you > use? Regards, The capacitor dielectric material might be something you could look at also. COG,
Electronics Forum | Thu Oct 25 11:29:04 EDT 2007 | ck_the_flip
Forget all the bickering and semantics. EVERYONE IS RIGHT!! ...but then again, in soldering, there IS no right, wrong, or indifferent... just blame. :-) Soldering is, after all, the most difficult process with the most opportunities for defects.
Electronics Forum | Wed May 22 10:27:42 EDT 2019 | Matt
thanks again for the feedback were your cracks mostly visible in relation to images shown in the document here: https://www.digikey.ca/en/pdf/t/tdk/guide-flex-cracking-mlcc most of our cracking has been lengthwise across the body which from what i
Electronics Forum | Mon Jul 12 13:06:32 EDT 1999 | Earl Moon
| I had parts replaced on SMT PWBs and the repair created measling defects. | Reliability Question: | Q1. Can measling be aggrevated or grow over time due to | temperature cycling and moisture. Customer environment is | -62C to +85C. | | Thank
Electronics Forum | Wed Jun 13 21:31:27 EDT 2001 | davef
Lotsa ways to bust caps. First: placement force; Second: thermal stress; Third: poor pad design. Forth: then, ummm maybe the cap supplier. Please describe the crack in more detail. Where does the crack start? Where does the crack go?
