Electronics Forum | Thu Aug 24 13:51:24 EDT 2000 | Dr. Ning-Cheng Lee
Low temperature aggravates the mismatch in thermal expansion between solder and parts and between components and boards, therefore can induce earlier failure. The low temperature screening test should not be as effective when used on soft solders su
Electronics Forum | Thu Jul 25 22:03:50 EDT 2002 | davef
I need help understanding your problem. * What�s the difference between �e-test failure� and �total failure�? * Why do you think that an ESD induced failure would only be a �total failure�? * What if this is caused by a cracked solder connection? Yo
Electronics Forum | Thu Sep 03 11:45:34 EDT 1998 | Dave F
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
Electronics Forum | Tue Feb 28 16:09:27 EST 2006 | outgasser
Does anyone have any insight as to the cause of cracked chip capacitors during SMT? Z-stop? Thermal shock? Any help is appreciated.
Electronics Forum | Wed Aug 24 16:30:10 EDT 2011 | hussman
Low and behold, the answer has been found. I guess 2512 parts are not used inthe automotive wolrd due to the fact that they crack during thermal cycling!
Electronics Forum | Mon Nov 12 10:57:36 EST 2001 | emmanuel
We are to use a PBGA 272 and a PBGA 388. Between 500 and 750 thermal shocks (-45�C/+125�C), we have noticed that some cracks appear in the solder joints. According to our component specialists, these cracks are due to the whole design (pcb, component
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Wed Sep 07 10:34:52 EDT 2005 | PWH
Have experienced this on a few different cap. parts. Agree with other postings. Following are solutions to problems we have had: 1) Cracked cap too close to board edge per IPC spec. Designer replaced part with 3 caps in series to eleviate stress
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
