Electronics Forum | Tue May 26 18:17:22 EDT 1998 | Jerry
Our experience has been that mechanical crack occur vertically through the chip. In other words perpendicular to the board surface. You can sometimes tell through close inspection that the crack may have propogated from a point that the nozzle may
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Thu Sep 03 13:49:30 EDT 1998 | Earl Moon
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Wed Sep 09 01:28:33 EDT 1998 | John Godfrey
| | I am in need of possible causes and solutions to capacitors that are failing in the field. | | Are there issues in our process that need to be | | checked? | | Some people said the problems are due to improper | | storage. Others say it is th
Electronics Forum | Thu Jun 06 12:54:23 EDT 2013 | emeto
I think that you will be fine. You don't want to crack the part during it's stay on a high temperature in the reflow oven(thermal shock...thermal stress...). Once you mount the part on the board it will collect moisture again, but it is already proce
Electronics Forum | Thu Sep 10 09:47:15 EDT 1998 | Earl Moon
| hi, | 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. | We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of e
Electronics Forum | Thu Nov 23 20:01:05 EST 2017 | myke03o
Hi to all experts, Can anyone advice us what solder alloy to use for thermal cycling products. We are facing a lot of issues using normal solder paste SAC305. After thermal cycling the solder is cracking. Any suggestion is welcome. Thanks in advanc
Electronics Forum | Wed Apr 22 08:40:18 EDT 2015 | markhoch
Hi Myriam, I think we may need some more information. Is the Electrolytic (Aluminum) Capacitor placed more than once per board? If so, are all locations twisting? This would typically be caused by a thermal imbalance that could be design induced. (u
Electronics Forum | Fri Nov 23 12:50:27 EST 2007 | bbarton
Do you have any input as to the vibrations seen on the end-use device? Types of device(s) that have solder joint failure? How many thermal cycles the PCB goes through before failure? There are several areas in production of the board that could be th
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
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