Electronics Forum | Fri May 15 16:02:40 EDT 1998 | John S
If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular compon
Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary
the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2
Electronics Forum | Thu Sep 07 11:01:52 EDT 2006 | davef
BGA cracking is caused by mechanical stress. This may be the result of: * Rough handling of soldered board * Inadequate consideration during package design of CTE effects on BGA * Poor control of or selection of thermal ramp rates during soldering
Electronics Forum | Wed Aug 24 12:37:38 EDT 2011 | hussman
Hello all, We just got some board back from thermal shock and we found that several of the 2512 resistors opened up. Actaully the solder joint cracked away from the board. All other coponents look great. Boards were good before test. 10 layer bo
Electronics Forum | Thu Aug 20 07:11:25 EDT 2020 | sssamw
What your said looks like a acrylic coating thermal expansion causes small solder joint crack. Do you cure coating with heating, or heating after curing? Solder joint crack while you see resistor and QFN trouble? Clear and detail description of your
Electronics Forum | Sun Dec 03 10:05:22 EST 2000 | Steven J
Greetings to all. We are currently experiencing cracking of the ceramic capacitors, on both primary and secondary sides of the PWB. The components range in size from 1206, 1210, to 1815s. The cracks do not appear to alter the electrical properties
Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef
Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o
Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca
Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Thu Sep 15 03:07:15 EDT 2005 | LeeHoMa
hi All, I am new to this forum and got a technical problem as below. Please see if anybody can help to solve it: I am currently producing one PCB board with 2 side SMD parts and all AI component in 1 side. I try to have both side SMD part soldered(
