Electronics Forum | Thu Aug 26 03:58:32 EDT 2010 | jacki
Hi all Did anyone encounter that the thermal crack failure or any failure issue by using the Kemet Ceramic Cap, particularly 0.1uF,while wave soldering? Before using this part, I want to clarify whether it is suitable for our process or not. Thanks i
Electronics Forum | Fri May 15 16:21:25 EDT 1998 | John s
| If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular comp
Electronics Forum | Fri May 15 17:59:31 EDT 1998 | Earl Moon
| | If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular co
Electronics Forum | Wed Dec 04 21:39:53 EST 2002 | davef
As you say, some BIG time force has pulled the metalization from the bottom of the component termination. From the pix it's hard to say whether it was caused by either: * Mechanical flexure of the board during an unusual heating or other processing
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Wed Aug 14 18:17:32 EDT 2019 | slthomas
We are down to the last few unresolved PCBA test failures in a work order and scrambling to get them repaired and into a mechanical assembly. What we have found in quite a few of these cases are cracked 1206 MLCCs. The failed parts are all the same
Electronics Forum | Fri Nov 02 08:10:40 EDT 2007 | floydf
Has anyone ever looked into the possibility for > laser marking 1812 size X7R ceramic chip > capacitors injecting sufficient energy to cause > cracking when voltage is applied? If so, what > were the findings? We are having failures of > caps
Electronics Forum | Thu Oct 15 14:23:31 EDT 1998 | Earl Moon
| I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder ma
Electronics Forum | Mon Jun 18 01:09:03 EDT 2001 | Dean Stadem
Igmar, If these parts are epoxied in place, and subsequently wave soldered, I would bet you a cup of coffee that they are cracking due to the thermal shock of the wave. Typically there is a valley or dip in the temperature after the pre-heat in the w
Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette
Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level
