Electronics Forum | Fri Mar 07 15:57:32 EST 2014 | jdengler
We have used the Stencilquik™ BGA Stencils from the same supplier to attach some LGA's for a prototype run. We were able to get a few different thicknesses to see which worked best. They worked very well for that limited application. We did not tr
Electronics Forum | Tue May 06 21:35:27 EDT 2014 | davef
Indium recommendations: 0201's: * Stencil Opening = 11mil x 16mil rectangle * Foot Print = 12mil x 15mil rectangle * Stencil Thickness = 5mils * Spacing = 9mils Note: The most common stencil being utilized, is the laser cut electropolished, and in so
Electronics Forum | Thu May 08 18:21:13 EDT 2014 | jorge_quijano
Hola, We are about to start building a new PCBA using a LGA, we have not used such components in the past, is there any recomendations you can provide me? I've found some articles saying that stencil thickness is the key, what is your experince usin
Electronics Forum | Tue Oct 07 22:15:12 EDT 2014 | padawanlinuxero
How to avoid /reduce warpage in long length PCB & > _1.6MM THICK PCB. You need to put it in a fixture or pallet to run it in the reflow oven, most common material use here is durostone for the pallets that we run in the reflow oven, we use Durosto
Electronics Forum | Fri Oct 17 16:31:53 EDT 2014 | dyoungquist
Per IPC-A-610D: Target is 100% vertical fill but 75% vertical fill is acceptable for Class 1,2,3. Only needing 75% fill of the barrel when soldering plate through on an 0.093" thick board with our selective solder has been a life saver at times.
Electronics Forum | Fri Oct 24 13:00:36 EDT 2014 | markhoch
I'd check into the ASYS LSB-03 Bareboard Destacker. It isn't a gravity drop style. It uses edge clamps to clamp the top PCB on the stack and then drop it on the transport rail. So it doens't destack from bottom to top, it destacks from top down. We
Electronics Forum | Mon Oct 27 20:01:00 EDT 2014 | rangarajd
Hello, We are facing solderability issues on a particular lot of board. THe Nickel thickness measured with an XRF is around 400 U inches. Spec calls out for 130 u inches Nickel and 3 - 5 U inches gold over it. Assuming there is no porosity on the g
Electronics Forum | Thu Oct 30 21:55:13 EDT 2014 | davef
Why soldering issues? I'd guess the nickel is corroded. It is very difficult to solder to oxidized nickel. Your SAC305 would get kicked all the way down the conveyor by nickel oxide. A lack of Ni-Sn-IMC formation will confirm this dewetting . What's
Electronics Forum | Wed Dec 10 13:26:03 EST 2014 | spoiltforchoice
I don't have one, but a lot of ovens of this vintage are on the market because they DO NOT cope well with lead free processes. There is one of these on eBay right now and it even says ROHS is right at the limit of what it can just about manage so thi
Electronics Forum | Thu Dec 11 09:27:16 EST 2014 | sreejhu
ALso, coming to the convection the DIMA service group said : "Its full convection in the top zones. The bottom zones are heating elements mounted underneath a thick aluminium plate. So not full IR, but the head is coming from the heated aluminium p
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