Electronics Forum | Thu Jul 16 10:40:12 EDT 2015 | migliore
Hi, Question 1: can anyone explain me what the VIA ASPECT RATIO is? Question 2: Let's say that a PCB manufacturer specifies a VIA ASPECT RATIO of 8:1. Can I have vias of drill diameter of 0.1 mm on a 2L board 1.6 thick? thanks, Enrico Migliore
Electronics Forum | Thu Sep 17 10:18:54 EDT 2015 | huske
What model do you have? Are you working with a Midas only or Hydra as well? Are you looking for basic information on how to get started with chips and SO's? Or like how to use auto-teach or manually measuring parts and programming or more like select
Electronics Forum | Tue Oct 27 11:30:57 EDT 2015 | atekcare
Didn't see if anyone responded to your question offline, but if you are still evaluating laser depanelers, we would like to help? Here are just a few key factors to consider. (1) what material are you cutting? (2) what is the material thickness (3)
Electronics Forum | Thu Jan 07 10:19:43 EST 2016 | dyoungquist
In 2014 we paid about $40K USD for a new Heller 1707 MKIII (no nitrogen) which is a 7 zone oven. One does not need a 8-10 zone oven unless you are doing high volume. We use the 1707 for everything including lead or lead-free solder, 0.031" to 0.093
Electronics Forum | Thu Feb 25 14:52:52 EST 2016 | tombstonesmt
How thick are their requirements? A barrier can be made using peelable latex. That would then require manual or automatic dispense of latex to create a dam. Then you should be able to use an automated dispense system with a large orifice and flood
Electronics Forum | Mon Jun 06 18:48:04 EDT 2016 | jlawson
Valor mss process preparaton has a stencil tool module that can do just what you want as well as alarm you if for a defined thickness what apertures need attention Is template driven so can save your stencil processing and settings.. Is powerful to
Electronics Forum | Wed Jun 08 08:14:48 EDT 2016 | lilblevs11
Some of our components cannot be cut and clinched. We do use one but some of the leads are too thick to clinch. I was thinking the same thing about the bean bags being on top with top side preheaters. That was one of the reasons I wanted to explore
Electronics Forum | Mon Jul 11 10:59:50 EDT 2016 | mnorthey
Other problems on previous machines that we have experienced is that there was not enough board support under the panel or that the panel thickness was inaccurate. Both situations can cause parts to bounce off the PCB or not to be pushed into the pas
Electronics Forum | Tue Jul 12 10:33:24 EDT 2016 | dontfeedphils
I'd start by checking and reteaching the nozzles (this is automatic, it'll measure the nozzle length and vacuum values for each nozzle). After that double check the value you have entered for the PCB thickness as this will impact where the machine t
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
