Electronics Forum | Sat Sep 04 11:58:44 EDT 2004 | Dhanashekar
Can anyone suggest me if it is necessary to measure the paste thickness after contact Screen printing.Is it a very vital parameter for the production process?
Electronics Forum | Sat Sep 04 18:52:51 EDT 2004 | iqbalb
Yes it is vital for process control.
Electronics Forum | Thu Sep 09 14:41:28 EDT 2004 | Martin
Shark here, reporting for duty.... www.kohyoung.com High speed, 3d 100% paste inspection.
Electronics Forum | Tue Sep 07 09:53:37 EDT 2004 | rob
Hi Dhanashekar, I'm with Chris on this one, unless you are carrying out 0201 or ultra fine pitch placement it's a helpful but not critical tool. We found most print errors were avoided using the 2D vision on the printer, combined with plenty of aut
Electronics Forum | Wed Sep 08 16:21:41 EDT 2004 | rohman23
I'm in a similar situation. We have a pre-historic semi-automatic printer that does a decent job, but would like to get an automatic printer. I've only just begun looking into the different options available, but would like one that could inspect t
Electronics Forum | Tue Sep 07 06:32:32 EDT 2004 | C Lampron
Dhanashekar, Yes this is an important proces control tool. This will show if you printer setup is correct however, I put more importance on coverage. If your paste height is 1 mil shorter than it should be, you may need to look at your printer setup
Electronics Forum | Thu Sep 09 04:15:36 EDT 2004 | Rob
Hi Chris, We use MPM's, where you can set the paste inspection to look at whatever you want it to (remember this does slow cycle time down) and we swear by them. However I have also met many happy DEK users who believe their machines are equally as
Electronics Forum | Mon Oct 06 12:37:18 EDT 2003 | ramanandkini
It was a nice discussion. What I did here was a thermal shock test 1 hour@ +90 deg.c and immediately 1 hour @ -40 deg.c. The second test I did was a high humudity test for a week. After each test, I carried out a peel test with scotch tape. Those bo
Electronics Forum | Mon Feb 19 17:34:02 EST 2007 | GS
Thank You Pavel and Dave, Unfortunately I do not have IPC-4554. Anyway I 0.6-1.0umm is what I remember, and confirmed by reading also through leterature available on google. I was just going to understand if it possible to obtain more thickness
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
.png)
