Electronics Forum | Tue Nov 16 06:52:44 EST 2010 | cacace
1 um". Some PCB manufacturer is telling me that this specification is not feasible in production. I would know if this position is due to the equipment (or process control) they have, or if in effect is not possible to satisfy my requests.
Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb
Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4（TG135,TG150,TG170,TG180），Halogen Free FR-4，Ceramic
Electronics Forum | Wed Nov 17 07:39:20 EST 2010 | jax
Most PCB manufacturers should be able to fall between 1.25um-5.00um for Pb-Free HASL. I doubt you will get anyone to agree to anything higher. If you are going to require an average thickness, make sure you also state "No Copper exposure allowed".
Electronics Forum | Fri Feb 24 11:31:20 EST 2012 | pauld
I need to be sure of the Nickel/Hard Gold thickness to be specified on our drawing. We use hard gold on a slip ring pcb that has brushes riding over the conductive surface, so soldering is not the issue. I read through the hard gold vs immersion gold
Electronics Forum | Sat Dec 10 07:33:09 EST 2005 | davef
Most board fabricators define a range of processes parameters that are routine for their plant set-up and methods. Look here http://www.divsys.com/ServicesProducts/PCB/MfgCapabilities.asp for an example. If you don't define your requirements, you'
Electronics Forum | Tue Feb 20 07:31:45 EST 2001 | Nick L
0.076 ~ 0.2 um(micron) but our substrate gold thickness is between 0.3~1.2um. Is there any related to the plating process of substrate! And how can they control this thickness?(May be I should ask substrate vendor their controlling limit). If this i
Electronics Forum | Thu May 23 10:18:02 EDT 2019 | emeto
A little hard to tell without knowing your part details and behavior and your PCB design. I have seen part warping so much that will show opens joints on the sides and short in the middle at the same time. Theoretically you should have area ration of
Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef
Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat
Electronics Forum | Tue Jan 09 01:39:41 EST 2018 | jaisabaigroup
Is there any regulation I can check on the Solder mark thickness specification? Or it is depends on PCB manufacturer's design.
Electronics Forum | Tue Jan 09 08:36:17 EST 2018 | pavel_murtishev
IPC-SM-840. If overall thickness is not specified in purchasing documents, a supplier will do whatever it wants. Specify your requirements. Typical values are 20-50um. Regards
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