Electronics Forum | Wed Aug 05 07:38:17 EDT 2020 | bangir
Hi Cris, Yes, The PCB thickness is 1mm. the PCB position below the rail thickness when the table go up the print position. Please advice or do you the service manual book.
Electronics Forum | Tue Jan 30 10:19:20 EST 2001 | ibi
I think that tolerance of pcb thickness is described in the �1-2-4 of IPC41-01 (Specification for Base Materials for Rigid and Multilayer Printed Boards Supercedes IPC-L-108, L-109, L-112, L-115, AM-361). Good reading,
Electronics Forum | Wed May 05 05:41:02 EDT 2021 | jineshjpr
Hi All, Need your suggestions on the below queries: 1. What will happen if the Au thickness maintained @ 0.5 to 1 micron (Where Ni Thick is within 3 to 5 microns) in 0.2mm Thickness FR4 PCB. 2. Is there any solder quality affcted during Reflow Solder
Electronics Forum | Tue Jun 25 01:24:25 EDT 2019 | sssamw
That is possibley CTE mismatch between QFN and PCB material, the thicker PCB the higher fail rate.
Electronics Forum | Fri Apr 28 09:36:56 EDT 2000 | Rick Landry
Can someone tell me the recommended via size for a .093" thick pcb. Bd is 6 layers, smt components on top side only and thru hole components.
Electronics Forum | Mon Mar 16 18:39:48 EST 1998 | Rin Or
Hi all, I would like to have some information regarding the paste in holes process.We are the Backplane manufacturing and dealing with lots of thick PCB and would like to change the processes from wave to paste in hole.Any feed back of info or exper
Electronics Forum | Thu Apr 27 04:21:15 EDT 2006 | slaine
you can either use an alloy that has a higher copper content to reduce dissolution or the better option is to have a Nickel plating barrier. both have there problems. Bu remember the dissolution of copper by tin carries on at a slower rate a ambiant
Electronics Forum | Thu Apr 27 08:26:35 EDT 2006 | davef
This is similar to a previous posting here on SMTnet, where, as we recall, one response suggested using a solder alloy with less tin.
Electronics Forum | Wed Aug 25 09:14:20 EDT 2010 | ozgurv
Dear all, Is there anybody who has got experience about the hollow jet wave soldering system? Is it usefull for SMD devices such as fine pitch components and Can it solder components which are on thick PCB's? Thanks.
Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v
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