Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Tue Feb 28 08:08:06 EST 2006 | davef
Tin is an excellent solvent. So, whether using lead-free or leaded solder, your wire will neck to one degree or another if the material of the wire dissolves in the metal of the solder.
Electronics Forum | Mon Jan 30 19:20:45 EST 2017 | jgo
Thanks Rob. I'm not so sure in a mass production environment that using the mount spray and kapton tapes are going to be efficient. For solder paste dispensing, any idea what is the smallest solder dot size the machine can dispense?
Electronics Forum | Fri Jan 27 17:36:40 EST 2017 | davef
Consider that printing may not be the only approach to getting paste on to your board. Would a dispenser work better?
Electronics Forum | Tue Jan 31 08:59:24 EST 2017 | rob
Hi Joshua, We ran 150K per week this way, you just need a lot of pallets. Regarding dispensing I've seen 0201 (Imperial)paste dispensed, so about 0.4ish mm dots. I'm sure the Mydata printer is also pretty high resolution too, but not too quick.
Electronics Forum | Mon Jan 30 05:58:39 EST 2017 | rob
Hi all, > > Am new to SMT here. > > I have a very > thin laminate substrate which around 120um > thickess. Being that thin, warpage is constantly > an issue for us. > > For the solder printing part, > we have a number of problems. > > Being s
Electronics Forum | Wed Dec 09 09:47:32 EST 2009 | dyoungquist
I am curious as to why you need to mix.... We use a 500g cartridge with air gun. Our process is remove the cartridge from the fridge, allow it to warm up to room temperature before inserting into air gun, then apply bead of paste to the stencil. N
Electronics Forum | Tue Apr 12 08:25:43 EDT 2005 | davef
Q1 Can anyone explain to me what is the clean and non clean solder? A1 The trend away from CFCs has lead many users to evaluate switching to no-clean soldering processes. The term "no-clean" is actually a common misnomer when used to describe a flux
Electronics Forum | Thu Jul 20 13:01:07 EDT 2000 | qsheng
What is the difference of formulation No-Clean Sn63 with No-Clean lead free paste? Is there techniocal data in detail for performance property of No-Clean lead free paste (for example, viscosity, solderability, tack, print life, reflow profile)? Is
Electronics Forum | Thu Oct 01 09:58:30 EDT 1998 | Jacqueline Coia
Could you tell me please when the lead free solder regulation will become mandatory in Europe and also what are the current industrial alternatives for paste, bar and wire. Cheers, Jack
