Electronics Forum | Wed Mar 10 15:45:24 EST 2010 | flipit
Looking for a large area wire ball bonder or wedge bonder. Must be able to take 4" X 5" panel and have a bond area of close to 3.5" X 4.4". Also need 6 to 8 wire per second. K&S no longer makes one. Panasonic no longer makes one. ASM does not mak
Electronics Forum | Mon Mar 15 15:14:08 EDT 2010 | cisridn
Does anyone have experience with reworking PCB's with coins bonded to the them? I have been having trouble with coins loosing the bond after rework and falling off. The material bonding the coin to the board is suppose to be able to withstand tempe
Electronics Forum | Mon Mar 29 10:20:29 EDT 2010 | CL
Good Morning Mark, I do not believe that you can group images from multiple cameras. You can save a camera image into the library but you would need to re-name the part number for the side camera if you have an image from the downward looking camera
Electronics Forum | Thu Mar 18 12:46:20 EDT 2010 | deanm
The standard J-STD-033B.1 addresses how to store moisture sensitive components. A dry box is a good, convenient way to store MSDs, but there are other methods to consider which are outlined in the standard. Are you sure that the problems are caused
Electronics Forum | Mon Mar 22 07:40:01 EDT 2010 | emanuel
Are you absolutely sure the problem is with the humidity? We had a problem with 3528 size leds, damaged by the pick and place nozzle because a 0.2mm mistake in the height measurement. Also, we found that several suppliers are using fake desiccant ba
Electronics Forum | Mon Mar 22 10:24:14 EDT 2010 | mun4o
Hi , I think that our problem is humidity, because when I use leds from new tape ( pack in MBB ) no any defects.After that, we put opened tape in our store.After 2-3 weeks I use the same tape with leds, and we have 2-3% defective leds.I make this tes
Electronics Forum | Tue Mar 23 03:42:51 EDT 2010 | grahamcooper22
Hi, It is very important to follow IPC JEDEC 33 specification for storage and handing of all MSDs. In many instances defects caused by excess moisture in packages is not immediately evident (pcbs may pass final test) but when pcb has been in the fiel
Electronics Forum | Fri Mar 19 12:53:35 EDT 2010 | pcbrookie
Hello everyone. I'm looking for some general information on reel counters. We are trying to tighten our inventory counts, and rather than estimate a reel we're looking into getting an accurate count via a reel counter. So first, I'm wondering what
Electronics Forum | Thu Mar 25 11:30:33 EDT 2010 | Sean
Hello Rajeshwara, If not mistaken, the 25% solder void specification is for BGA...As I I as know, no specification given to mosfet component yet..I think you are right, I need to look at the stencil aperture in order to reduce the air trap underneat
Electronics Forum | Fri Mar 26 00:57:05 EDT 2010 | 89jeong
Hello Sir. We also have faced a same problem. At that time, we had to repair it because we could not find any solution. But in our experience, the void underneath FET was more severe whenever we used the FET that have been made long time ago. It is
