Electronics Forum | Wed Aug 11 15:48:54 EDT 1999 | JohnW
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Wed Aug 11 15:58:39 EDT 1999 | Doug Philbrick
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Fri Aug 13 07:26:06 EDT 1999 | Brian Conner
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
Electronics Forum | Fri May 22 10:43:23 EDT 1998 | Mike Konrad
You're right Earl� Drag soldering is a dead issue as far as new technology is concerned. They do, however, work for most through-hole boards� but so do wave machines. There are only two manufacturers left that still produce drag soldering machine
Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon
| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
Electronics Forum | Wed Oct 07 15:15:04 EDT 1998 | Joe P.
| I am currently experimenting with Pin-To-Paste reflow. does anyone know some excellent references or links that could give me tips and tricks, optimal aperature dimensions, etc. I have been informed that if I have pull through that I should put a
Electronics Forum | Thu Aug 05 08:04:32 EDT 1999 | Peter Barton
| Hi , | | Could DIP package ( PTH) run through IR Reflow instead of wave soldering? | | Will there be any reliability impact on this package. | | Thanks | | Jack | | Jack, The dip component package material and the packaging process is the sa
Electronics Forum | Tue Jul 14 13:47:53 EDT 1998 | Mark Barnett
There's a battle brewing around here regarding the use of press fit connectors in place of their thru hole counterparts because of suuposedly better reliability. Is there any validity to this statement? Up until now, we have only been going with pr
Electronics Forum | Mon Nov 11 13:46:43 EST 2002 | ksfacinelli
I have a interesting problem. I have a client that would like us to build 15-20 prototypes of a fairly complex design that contains a Enplas OTB-289-0.8 BGA socket. The problem I have is the customer does not have enough sockets and is asking if we
