Electronics Forum | Thu Sep 12 12:45:56 EDT 2013 | deanm
> manual insert any remaining odd form components >> selective solder or hand solder if needed.
Electronics Forum | Sun Nov 23 20:37:36 EST 2014 | gregp
Hi J_Dub, thanks for the continued info...Of course selective soldering would be very time consuming for such a through hole assembly...but 18 minutes, wow...didn't realize selective soldering could take that long. I would like to know the approxima
Electronics Forum | Tue Sep 10 10:17:18 EDT 2013 | gregp
Hi Reese, Thanks for the feedback. So you have a fair amount of assemblies that are new designs with 10% through hole parts. Are these parts inserted manually? What is the soldering process?...wave solder?...selective solder? Do these components
Electronics Forum | Fri Nov 21 12:12:44 EST 2014 | joe98375
On average there are about 3 parts per board that get hand placed (x24 is 72 parts per panel). One of these parts is a big 1W resistor that cannot fit on our axial machine. We also have a Zener Diode that needs to be hand placed because its leads are
Electronics Forum | Fri Nov 21 11:00:27 EST 2014 | gregp
Hi J_Dub (Joe), Thanks for the input. Sounds like some fairly densely populated through hole assemblies. 100 solder joints per board is up to 50 parts per board (I know you may have DIP's so it could be less than 50). 24 boards in a panel x 50 par
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Tue Jan 18 12:36:11 EST 2000 | Dave F
Dave: I haven't located something to support your contention, yet, and I'm not going to comment on the factors that drive reliability beyond component selection, because I know that you've got some sweaty-palmed sales type wringing his hands waiting
Electronics Forum | Fri Feb 17 18:33:08 EST 2006 | mika
Paste In Hole "PIH" or Pin In Paste "PIP" are two different names of the same process. As far as I know this is fairly simple: the reason from the beginning is to avoid an extra process step/steps in the production line. That is to produce through h
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
