Electronics Forum | Thu Jun 02 08:42:06 EDT 2016 | emeto
Several important things to watch. 1. More paste can result in more voiding(I usually shoot for 50-65% coverage) 2. Make a different grid(windowpane) for you pad - try with more smaller windows 3. Try both ramp to spike or Soak profiles and see whic
Electronics Forum | Thu Jun 02 22:40:13 EDT 2016 | slouis2014
Hi, yes have a few experiments initially i tried to increase the solder volume but component pin have insufficient solder. 1. The solder coverage do you calculate it by solder volume or solder area. 2. if i would achieve as you recommend 50-60 % woul
Electronics Forum | Tue Oct 01 15:48:56 EDT 2002 | lysik
No problem. A standard stencil is OK. You want to print a half moon shape on each side of the hole. Make sure you print about X2 the size of your hole and make sure you keep the print in close to the hole. You want to print X2 the hole size as to hav
Electronics Forum | Thu Sep 12 12:45:56 EDT 2013 | deanm
> manual insert any remaining odd form components >> selective solder or hand solder if needed.
Electronics Forum | Wed Feb 07 11:27:25 EST 2007 | asoe
I just wonder anyone had the idea of solderability test for through hole by using a wetting balance equipment? I read the jstd002/003 however my feel is now our machine (metronelec st60) is not capable of this test?
Electronics Forum | Tue Sep 10 10:17:18 EDT 2013 | gregp
Hi Reese, Thanks for the feedback. So you have a fair amount of assemblies that are new designs with 10% through hole parts. Are these parts inserted manually? What is the soldering process?...wave solder?...selective solder? Do these components
Electronics Forum | Thu Oct 03 04:04:10 EDT 2002 | Bob Willis
SMTNet has a video tape and interactive CD ROM on Intrusive Reflow Soldering that you may want to check out. In addition there are some free inspection standards for pin in hole printing, placement and soldering available at http://www.dpmo-monitori
Electronics Forum | Fri Oct 04 12:02:53 EDT 2002 | mzaboogie
Hi Barry, One consideration that you may want to consider is the lead to hole ratio. The higher the ratio, the less solder is required to fill in the gaps and give you a fillet. Heat is a concern. You will need to ensure components will take the he
Electronics Forum | Sun Nov 23 20:37:36 EST 2014 | gregp
Hi J_Dub, thanks for the continued info...Of course selective soldering would be very time consuming for such a through hole assembly...but 18 minutes, wow...didn't realize selective soldering could take that long. I would like to know the approxima
Electronics Forum | Sun Mar 15 14:10:26 EST 1998 | baruch schiffmann
we are looking for paste printing specs.& stencils holes shapes to perform soldering reliability d.o.e. of the a.m. subject. looking forward to your info. tech. dept. /telrad prod.
