Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Mon Sep 09 16:29:56 EDT 2013 | gregp
Hi Everyone, I'm looking for some feedback about through hole assembly requirements today vs. yesteryear. As I see it, there are two main categories...legacy through hole and new through hole with mixed technology. The legacy stuff is older designs
Electronics Forum | Wed Jul 07 14:14:03 EDT 1999 | Dave F
| Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th
Electronics Forum | Wed Sep 11 10:48:02 EDT 2013 | gregp
Hi Reese, The UIC machine is (was) good for higher volumes. Do you think these machines are less appropriate for smaller lot sizes and PCB's with just a few through hole parts? Also, are the UIC through hole machines still fully supported with ampl
Electronics Forum | Fri Nov 21 10:28:23 EST 2014 | gregp
Hi Adam, So with two to three people on the slide line, each only able to place five different components maximum, this means you generally don't exceed 10-15 through hole parts per assembly, correct? I am guessing these are mixed technology boards
Electronics Forum | Thu Jul 08 12:33:52 EDT 1999 | Mike Demos
Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. I wi
Electronics Forum | Mon Nov 17 13:43:39 EST 2014 | gregp
So we all know through hole assembly hasn't been completely eradicated. I am doing some research as to the types of through hole assembly that still remain. My questions are related to through hole requirements and past, current and future methodol
Electronics Forum | Tue Oct 01 12:23:26 EDT 2002 | barryg
We are looking at possible doing a few through hole components on the smt line. Is this feasable? What types of components are diffucult to do this way? What stencil considerations are there? Anyone have any info on this subject?
Electronics Forum | Wed Feb 07 11:27:25 EST 2007 | asoe
I just wonder anyone had the idea of solderability test for through hole by using a wetting balance equipment? I read the jstd002/003 however my feel is now our machine (metronelec st60) is not capable of this test?
Electronics Forum | Tue Jul 06 16:44:14 EDT 1999 | John Thorup
| Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th
