Electronics Forum | Thu May 21 22:07:47 EDT 1998 | Mike Konrad
I am a former employee of a drag soldering machine manufacturer. For years they attempted to devise a method of soldering surface mount devices via the drag soldering machine. Bridging was the largest problem along with component damage due to exce
Electronics Forum | Fri May 22 22:13:27 EDT 1998 | G. Henning
Thanks for the advice. We are experiencing only limited success with SMT on the drag. Problems are indeed bridging and misses on the smaller discretes. Works well on PTH as long as the pitch is not too tight. I'll have to justify a new machine. Rega
Electronics Forum | Thu May 21 22:20:18 EDT 1998 | Earl Moon
| I am a former employee of a drag soldering machine manufacturer. For years they attempted to devise a method of soldering surface mount devices via the drag soldering machine. Bridging was the largest problem along with component damage due to ex
Electronics Forum | Tue Sep 23 13:08:26 EDT 2008 | slthomas
Put the new stuff in the back and pull from the front. A pass through from stores makes that a lot easier. Bar codes are a wonderful thing if you can get people to use them. Wand it into stores then wand it sequentially into production via a queue.
Electronics Forum | Tue Mar 24 11:20:18 EST 1998 | Earl Moon
| Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via? Typically, micro vias are drilled and plated to about .003" diameter. To avoid significant solder "drain off," they should be drilled as shallow
Electronics Forum | Fri Aug 06 07:16:36 EDT 2004 | davef
When moisture outgasses through plating, it continues through the molten solder, causing a meak solder connection. There's another issue with thin plating that we haven't focused on in this thread. If plating is thin, the stress on the barrel of a
Electronics Forum | Wed Apr 21 15:27:24 EDT 1999 | Murray Pulman
Hi Scotty sorry to stir things up but we assemble some seriously high value boards on a contract basis with vias through bga pads. However, not blind vias, so there are no cleaning issues & we use 6 though stencils to provide a little extra paste t
Electronics Forum | Tue Nov 20 12:31:12 EST 2007 | kelz
In my past experience, having via's under or attached to SMD lands produces risk. Solder will not consistently wick the same if it is being drawn into a via. This has also caused issues from solder wetting through the via to the other side causing a
Electronics Forum | Fri May 22 10:43:23 EDT 1998 | Mike Konrad
You're right Earl� Drag soldering is a dead issue as far as new technology is concerned. They do, however, work for most through-hole boards� but so do wave machines. There are only two manufacturers left that still produce drag soldering machine
Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10
It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often
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