Electronics Forum | Thu Jun 25 08:30:38 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Wed Jun 24 14:08:34 EDT 1998 | Henry Lee
I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will solder
Electronics Forum | Thu Jun 25 08:30:39 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Tue Jul 15 16:12:23 EDT 2008 | boardhouse
Hi Armynski, I sell for an offshore board house, yes, it is common for offshore board shops to fill vias. The bubble is caused by air entrampment within the hole it self, when heat is applied during Hot air and the via is covered on both sides the e
Electronics Forum | Tue Sep 17 15:03:31 EDT 2002 | davef
Contact: * PCD Magazine [ http://www.pcdmag.com/mag/reprints.html ] and ask them to send you a reprint. * Jim Blankenhorn [ http://www.smtplus.com ] and ask him to send you a reprint. Or try: * �Assembly And Interconnect Reliability Of BGA Assembled
Electronics Forum | Tue Dec 17 11:01:24 EST 2002 | Tim Marc
Hello all, One of our PCB manufacturers coated a through hole connecters vias with solder mask. The only IPC references that comes close to describing this problem is 2.9.2 Registration to holes, and subsequent specification 6.3.1 PTH � Vertical fil
Electronics Forum | Tue May 12 04:15:48 EDT 1998 | Chris Sargent
Help! We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The pro
Electronics Forum | Tue Sep 22 09:07:02 EDT 1998 | Steve Gregory
Hi Jacqueline! Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? If that is true, are there many vias concentrated aroun
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