Electronics Forum: through vias (Page 10 of 33)

Accidental solder mask

Electronics Forum | Tue Dec 17 17:47:49 EST 2002 | Tim Marc

Dave, I�m talking about the 75% vertical fill of solder IPC 6.3 criteria (B), and 6.3.1 Fig 6-5. I also referred to the annular ring of the Plated-Through-Hole, being coated with solder mask. Semantics, yes I did refer to the Plated-Through-Hole (Sup

Handling PCB assy's

Electronics Forum | Thu Oct 31 15:32:33 EST 2002 | slthomas

Whoa, I have (for a long time) been under the impression that lead can only be absorbed via the mucus membranes, not through skin as in the hands. Did I miss something?? Not that I behave would much differently, other than donning gloves whenever I

Re: Thermal excursion

Electronics Forum | Thu Feb 03 21:17:07 EST 2000 | Dave F

AF: Unfortunately, there is no "acceptable number of cycles" either in air-to-air and one liquid-liquid thermocycling, nor interconnect stress testing. There can be a "minimum threshold" that would assure no failures as the result of the assembly p

Clean vs No Clean PCB assembly process

Electronics Forum | Thu Jul 26 22:52:47 EDT 2001 | davef

GT 8 years ago every board saw "touchup". Touch was done to fix boards to conform to A-610. Now A-610 allows less than complete hole fill. Our operators were totally freaking nuts about touching boards. They touched each others touch and on and o

Re: BGA Shorts?

Electronics Forum | Thu Feb 04 09:22:56 EST 1999 | Terry Burnette

| Hello all, | | Are BGA's easy to develope shorts? If a process is stable and all of a sudden you get BGA's shorting out on you, what might be problems? | | We've checked our solder paste amount, and we've rechecked our reflow profiles and nothin

flux residue problem

Electronics Forum | Fri Sep 04 02:09:03 EDT 2009 | sachu_70

Hi Walter, Do you refer to a sprayfluxer operation? The problem seems to be a parameter setting issue. 1. Ensure the wide angle spray reaches PCB with optimum jet pressure. You could pass a glass plate to understand flux coverage and view Jet pressur

Poor Reflow with Ground Planes for Wave Solder

Electronics Forum | Thu Aug 13 16:57:32 EDT 2020 | rgduval

Is that no solder on the left hand pins in the picture? If so, it could be a directional thing. Have you tried turning the board 90º or 180º from the current direction of travel? Not a huge fan of wave solder for SMT components personally, though,

What method for cleaning a wiped board?

Electronics Forum | Thu May 04 01:52:17 EDT 2023 | davef

Look at IPC-7526 - Stencil and Misprinted Board Cleaning Handbook, Misprinted Circuit Board CleaningCLEANING [ https://www.multi-circuit-boards.eu/fileadmin/user_upload/downloads/leiterplatten_design-hilfe/ipc-7526.pdf ] ITW/EAE says "Typically, th

Reflow Profiling

Electronics Forum | Tue Jul 11 11:59:34 EDT 2000 | George English

Looking for some welcome advise again folks. We are currently using a reflow profiling software package which requires passing a data logging unit through the oven attached via thermocouples to a populated 'dummy' PCB. The problem is we have a very

Pad Design

Electronics Forum | Mon Apr 16 10:01:43 EDT 2001 | onset

Please help, Engineering has come to me with a crazy idea of putting vias straight through 0805 pads due to limited board space. I was wondering if this has ever been attempted by anyone and if it works. I'm assuming it will have negative affe


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