Electronics Forum | Thu Dec 29 22:19:36 EST 2005 | Joseph
We have tested SN100C for LF wave soldering process since August'05 and currently start production for a month ago. Initially we use SAC305, but due to the shrinkage cavities (micro-crack) we changeover to SN100C. In summary, SN100C did perform well
Electronics Forum | Sat May 15 09:28:44 EDT 2010 | dekhead
I worked with a customer about 2 years ago on a process similar using ProFlow head to put paste in holes for through hole... Similar to Pin in Paste. Somewhat successful; but ran into heat related damage issue from TH components through reflow.
Electronics Forum | Wed Sep 01 05:43:08 EDT 2010 | ranco13
Hi, does anyone has any experience waht so ever with waterman wave soldering with 7 lines of holes? We are now planning to take our assembly line to waterman 7 lines, instead of 5.
Electronics Forum | Sun Jan 01 21:02:54 EST 2006 | sumxp
Please elaborate more on hole fill issue.How difficult to optimise the process para?
Electronics Forum | Tue Sep 22 15:30:29 EDT 1998 | Rob Williams
| I'm looking for information on "volcano" soldering or mini-wave soldering. I need to solder a leaded device, thru-hole, on a already populated smt PCB. I want to do localized soldering on the pins of the device. | Any help would be greatly appreci
Electronics Forum | Thu Apr 30 09:27:58 EDT 2020 | clockwatcher
I currently have a board that has several wires that need to be soldered into it. Many years ago I remember wave soldering power supply boards that also had many wires. In order to keep the wire insulation out of the solder fillet and keep the wires
Electronics Forum | Mon Aug 16 04:55:30 EDT 2004 | roel
Concerning the solder-balls, there are a few causes for this. Try to slow down your solder-speed (P.e 80cm/min). Can you measure temperature after the pre-heat zone? Are there also blow-holes in the joints? Personally I think there is some water in t
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Tue Jan 10 14:44:42 EST 2006 | greg york
Not sure about Sn/Cu/Ni large market share here in Europe as we have a large part of the UK market with SACP0307 alloy 0.3%Ag introduced over Two years ago Also worked against Sn/Cu/Ni alloy with large TV Co and they went with 0.3%Ag due to reliabili
Electronics Forum | Thu May 28 09:23:59 EDT 1998 | Chrys
| Hello, | | I need some users information about "hot air knife" after the wave | bath: | - Defects reduction ? | - In what kind of boards(TH/SMT SOICS ect.) it is applied ? | - Where can I purchase it as a retrofit (Soltec Delta 6622cc) ? |
