Electronics Forum | Thu May 09 17:16:16 EDT 2002 | davef
Russ makes a good point. While your profile probably meets your paste supplier recommendations, it may not be proper for the component. * Paste suppliers offer general recommendations for tin / lead interconnects. You need to modify that for board
Electronics Forum | Mon Dec 09 21:00:39 EST 2019 | sssamw
Did you solve this issue? It doesn't much look like the flux dried out, ti should be across whole board and has much more same defect if flux dried out. Did you have failure ratio data to show the defect location, for example 10% at location A on bo
Electronics Forum | Thu Dec 09 17:18:44 EST 1999 | Russ
Ron, I'll bet you have the Ni/Pd finsh on these components! We have had the same problem in our shop. Not knowing the Kester spec. we had to raise the max temp to 220 Deg. C and increase the time above liquidous to 60 seconds or greater. It seem
Electronics Forum | Fri Feb 23 10:10:32 EST 2024 | emanuel
Well, the story is a little more complicated. The product is also an LED lamp made on an aluminum PCB with the LEDs on one side and the drivers on the other. The board itself is not big, about 90x90mm and most of the components are soldering well. Us
Electronics Forum | Wed Nov 19 14:08:55 EST 2008 | stepheniii
TI was leadfree before ROHS. I saw TI solderability issues over 10 years ago. The leads have paladium and need higher reflow temperatures.
Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef
Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
Electronics Forum | Wed Dec 10 10:05:07 EST 2003 | davef
We do not have experience soldering to the PVD surface you plan to use. We use Titanium [Ti] stiffeners in wave soldering and our wave equipment manufacturer uses Ti fingers, nozzles, pump blades, and other parts, because solder doesn�t stick to Ti.
Electronics Forum | Wed Oct 02 00:08:26 EDT 2002 | praveen
Hi, We are using chip components with Silver Pladium coating and finding poor wetting. We are using the water wash solder paste with 2Ag and std. reflow profile. Any suggestion how ti improve the solder wetting for those components. Thanks,
Electronics Forum | Thu Aug 07 16:12:03 EDT 2003 | davef
We have been soldering lead-free components on the products with SnPb solder for 10 plus years. Over those years, TI has shipped 20 billion parts with Pd solderability protection. Turn-up the dial on your oven and push on to other things.
Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef
You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a
