Electronics Forum | Fri May 25 13:38:15 EDT 2007 | mfgengr
TAL Too Long - dull solder joints, dewetting. TAL Too Short - cold solder, insufficient wetting. You want TAL to be as short as possible (but not lower than 30 seconds), but long enough for every solder joint to be above TAL for at least 30 seconds.
Electronics Forum | Wed May 09 17:13:06 EDT 2007 | zanolli
Re: 63/37 paste reflow Is there a standard reccomended time (ball park) above liquidus? What are the negative ramifications if the TAL is too short or too long? Thanks in advance
Electronics Forum | Mon Jun 25 19:36:36 EDT 2007 | bga_kid
If you calculate CFM using the numbers you have provided you are pulling 1396CFM out of the oven. I am not sure what Hellers spec is but I know a Speedline OmniExcel Air machine should be set at 300CFM. I do know for a fact that to much exhaust can s
Electronics Forum | Wed Feb 08 07:52:21 EST 2006 | davef
'TAL' is a poor measure of solder connection heating. In a reflow process, what you need is about 5 seconds at liquidus for the specific solder plus: * 20*C when soldering to Cu. * 35*C when soldering to Ni. This time over temperature is measured
Electronics Forum | Fri Feb 10 12:21:44 EST 2006 | Cal Kolokoy
DaveF is correct in saying that TAL is not the best metric to use in reflow soldering. That is why paste manufacturers give such a wide range; typically 30 to 120 seconds. The peak temperature is more important, especially in the mixed Pb and Pb-F
Electronics Forum | Wed Oct 19 07:04:06 EDT 2022 | winston_one
If any changes in design is not possible and you have to solder it, it's a real headache, I know... I see only 3 options here that you can try consiquently: 1) Accurately profile the board and optimize a profile (go to lower limit of process windo
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon
Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your
Electronics Forum | Tue Nov 05 09:57:45 EST 2013 | cuperpeter
Hello All, We have a problem with dewetting of solder paste. Problem is most visible on the pads without components (see attached pictures) and occurs randomly, 20% of PCB's. Pcb supplier sent us a cross-section of pads with thickness of Cu, Ni and
Electronics Forum | Wed May 19 10:48:40 EDT 1999 | Glenn Robertson
| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | I ha
