Electronics Forum | Tue Oct 04 12:49:59 EDT 2005 | patrickbruneel
The amount of times the tin/lead solder can be melted and solidified is unlimited and the heat cycles do not affect the solder characteristics. The only reason for changing the solder pot is when impurities are at or over the maximum levels.
Electronics Forum | Wed Aug 27 07:13:05 EDT 2008 | eyalg
I need to solder SAC/HASL PC boards in a NON ROHS process (Tin Leaded solder paste and profile + Tin leaded components) Can I do that?? Regards, Eyal
Electronics Forum | Tue Jun 06 19:03:59 EDT 2017 | zsoden
Hi Steve, I just confirmed with the manufacturer and the HASL is tin/lead (or it is supposed to be, at least). Any suggestions for how to test for nickel vs tin/lead? We're using an alcohol based no-clean flux from Alpha.
Electronics Forum | Fri Jun 17 10:47:48 EDT 2005 | davef
Doug: We agree that imm tin can be easily stripped and reapplied. Do you order imm tin as bright/ dull? Is bright/dull a function of who the fabricator lisences the process? Er wha? Electroplate tin can be either matt or bright. It is different
Electronics Forum | Wed Nov 20 16:47:10 EST 2013 | aaronpavone
I have a right angle male shrouded connector and the whole set of termination leads is tin lead plated, at least 100 microinches thick. Should the entirety of the lead be conformal coated? Or can we have just the joint coated? I know I have coated le
Electronics Forum | Wed Aug 23 09:20:16 EDT 2000 | Dave F
Dr. Lee: What are the benefits, advantages, disadvantages, etc of including silver in "traditional" tin lead solder pastes?
Electronics Forum | Thu Apr 15 08:21:47 EDT 1999 | Terry Keen
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Thu Apr 15 09:45:34 EDT 1999 | Terry Keen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Fri Feb 22 15:08:32 EST 2002 | rkevin
Thanks for the input.
Electronics Forum | Wed Mar 29 15:37:44 EST 2006 | bga rosh in a tin lead process
should I expect any issue using a lead free BGA with tin lead paste and oven profile???
