Electronics Forum: tin/lead (Page 4 of 52)

Leadfree component plating on Sn/Pb paste

Electronics Forum | Mon Jun 23 11:02:33 EDT 2003 | Kris

Hi, No Major issue using lead-free plated components in tin-lead as long as Sn/Bi is not the finish. I think some customer might be worried about low melting phase. More voiding may be seen in case of ceramic capacitors used with tin-lead. It is

SM termination with Nickel barrier with 100% tin plated finish

Electronics Forum | Tue Nov 11 12:49:13 EST 2003 | Carol

Could you direct me to a Standard or Study that has used this termination with 67/37 tin/lead solder please? I am looking for the recommended reflow temperature requirements and reliability issues for the completed product. We are receiving this type

lead free platings and tin lead

Electronics Forum | Tue Aug 31 11:57:03 EDT 2004 | Kris

Hi Any body have any issues soldering tin lead solder paste with lead free terminations ? Components are leaded devices and chip components have read the theoritical discussions on the forum, need to know if any body has seen any real issues tod

How long does it tkae for Tin-Lead solder to rust if put outside

Electronics Forum | Thu Sep 27 15:16:34 EDT 2007 | novaman

Hi everybody, I did post in the past last year and I always got good answers. If I'm going to solder something with Tin-Lead solder and then put it outside (it will be exposed to water, sun, cold nights,...), how long does it take starting to rust?

How long does it tkae for Tin-Lead solder to rust if put outside

Electronics Forum | Mon Oct 01 15:44:13 EDT 2007 | hussman

A simple answer is never. Tin lead will oxidize when exposed to oxygen, but it will not rust away like normal steel. I have old equipment from the 1920�s and 1930� that have solder joints as robust as the day they were made. Maybe not as shinny, b

SAC305 Lead Frame Component with Leaded Process?

Electronics Forum | Tue Sep 16 09:25:49 EDT 2008 | trynders

I had a vendor change thier lead finish from tin/lead to a SAC305. We built up several assemblies before we realized the change. The reflow process is a standard leaded profile peaking at 220 C. What are the reliablity concerns with mixing the tin/l

Lead-free BGA in Tin/Lead Process

Electronics Forum | Mon Oct 04 18:48:43 EDT 2010 | rsthompson

I am trying to assess current industry thinking on the question of whether or not lead-free BGAs (SAC or other) can or should be soldered in a tin/lead process. It seems there are differing opinions on this and I'm wondering what some of you are doin

Lead-free BGA in Tin/Lead Process

Electronics Forum | Tue Oct 05 14:34:40 EDT 2010 | 18424

I am trying to assess current industry thinking > on the question of whether or not lead-free BGAs > (SAC or other) can or should be soldered in a > tin/lead process. It seems there are differing > opinions on this and I'm wondering what some of

Tin/Lead HASL Plating in a Lead Free Process

Electronics Forum | Tue Jan 31 13:26:31 EST 2012 | joeherz

Anyone doing consigned work in the EMS industry has had this issue, I'm sure - Customer says they want lead free processing at the quote stage - PCBs they supply are tin/lead HASL. In this case, no HDI components and no BGAs. What is the latest acc

Re: Wave solder edge covers

Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner

| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins


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