Electronics Forum: tin/lead (Page 5 of 52)

Re: 2% silver solder paste

Electronics Forum | Fri Apr 16 11:07:53 EDT 1999 | Vic Lau

| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t

What is too much silver in a joint

Electronics Forum | Sun Mar 31 10:03:25 EST 2002 | Bob

Cheers Dave, to answer some of your questions. � The component lead is copper with a tin / lead coating. The pads are standard Copper / Nickel / Gold. � The solder is standard Tin / Lead / Silver (2%) We have a lab that can determine the composition

reflow / soldering temperature

Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre

use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

Immersion Ag

Electronics Forum | Fri May 24 07:09:52 EDT 2002 | Andy Hoggan

Teh amount of silver on an immersion silver board won't effect 62/36/2 tin/lead/silver solder, however if the silver on the board is on the thick side and you have a high trace silver content in a 63/37 tin/lead then with the combination of the two y

SAC BGA in Pb Process

Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef

SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s

Tin Lead Solder Paste

Electronics Forum | Wed Aug 12 11:09:42 EDT 2015 | jvalverde

Hello, I have a problem with the solder paste process, I need a solder paste with no Start-up Time because We do not work 24 hours in the manufacturing process, we works only 8 hours a day and at the finish we need to store the paste in the refr

Re-Tin Leads

Electronics Forum | Thu Mar 25 10:25:46 EST 2004 | sjpence

For lead tinning services you might want to try: www.sixsigmaservices.com www.corfin.net Both of these companies will re-tin SMT.

Re: Paladium Leads Revisted

Electronics Forum | Sat May 23 17:30:44 EDT 1998 | Steve Gregory

| My question is: How does one recognize paladium leads so that the profile can be set properly? | Dave F Hi Dave, It's kinda' subjective, but what I think it looks like is almost like having a nickel appearance to it, it's smoother and not as

PCB finish - Printhead vs Squeegee

Electronics Forum | Wed Sep 19 16:02:14 EDT 2001 | fcouture

Pad Metallurgy Used: >Is your question about this targeting the current industry capability of using tin plating technology on such small >pad dimensions? Actually I should have asked for tin/lead plating (HASL) and yes it's to have an idea on capab


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