Electronics Forum | Wed Jul 29 13:44:45 EDT 1998 | David Spilker
We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone had
Electronics Forum | Wed Feb 08 04:08:35 EST 2006 | fctassembly
Hello Greg, I agree with you that the article in SMT Magazine should be studied very carefully as it contains many errors in respect to SN100C. The testing performed was a DOE and was not an optimized run. There is also a statement on dross generatio
Electronics Forum | Tue Feb 07 13:39:42 EST 2006 | gregoryyork
You can use straight forward Tin/Copper but it flows very poorly so solderability is an issue. Dosing with Phos improves this but need to stay on top of it. We have supplied some 3.8%Ag alloys for flow they work well but you get a small 'chill point'
Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Wed Jul 29 22:50:17 EDT 1998 | Dave F
| We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone ha
Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
Electronics Forum | Mon Dec 14 10:53:10 EST 1998 | Earl Moon
| Has anyone had any experience with using this alternative plating process? Some board houses are pushing toward this plating. Is there any long term data on this process? Any problems experienced with smt and thru-hole? I've heard tin whiskers to b
Electronics Forum | Sun Jun 01 13:50:12 EDT 2014 | sync40
Thank you for your reply davef. Although the US restriction, I think that there are plenty of users of immersion tin in Americas, mainly low-volume fabs that do not plan to outsource finishing, or do not plan or can not invest in a HASL. If we res
Electronics Forum | Tue Sep 14 10:10:39 EDT 2010 | teamcanada
We are having an issue with a PCB supplier. Their Tin HASL layer seems to be the problem. We have triedworking with them to correct their process. What seems to have helped is lowering their temperature of the Tin dip from 540 F to 510 F.We still ha
Electronics Forum | Mon Nov 25 15:55:32 EST 2002 | davef
Sorry, no tricks for you. The good news is: your reflow recipe should be similar for both imm tin and HASL. Imm tin requires more attention to detail by both the fabricator and the assembler than HASL. There is a fair amount of discussion on imm
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