Electronics Forum | Fri Apr 09 20:28:14 EDT 2004 | Ken
I have experience in this. My company offers Lead free SMT and Wave soldering. I have processed ImSn, ImAg, Enig, OSP in both smt and wave. Yes, silver leaching will occur. Yes, copper leaching will occur. High tin content solders disolve everyt
Electronics Forum | Wed Apr 07 09:23:20 EDT 2004 | davef
In addition to your concerns about leaching, why aren't you concerned about: * Tin whiskers * Total absence of in use reliability information about no-lead, especially given that creep is significantly different between SnPb and no-leads. While they
Electronics Forum | Thu Oct 18 18:39:15 EDT 2001 | davef
Responding to your questions ... RELIABILITY OF 1% SILVER SOLDER PASTE: It�s as good as the next solder paste, all other things the same. Look at your back articles by Jennie Hang in SMT magazine. I want to say she wrote an article on the topic i
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Tue Jun 15 17:36:32 EDT 2004 | johnthor
I don't recall if a specific alloy was mentioned just that most lead free alloys would not melt with a Pb profile and result in a less reliable joint in the long term. There was also concern about tin whiskers. Try the archives at http://www.ipc.or
Electronics Forum | Mon Feb 27 06:42:37 EST 2006 | Slaine
What are the long term issues with high tin content solders on parts plated with silver over copper? Is it possible that the silver will be absorbed by the solder then over a long period of time the tin will react with the copper causing it to part
Electronics Forum | Sat Dec 22 01:34:26 EST 2018 | sara_pcb
My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product. 1. Is there any long term reliability issues with 2% Ag in BGA Ball. 2. If the PCB finish
Electronics Forum | Fri May 24 07:09:52 EDT 2002 | Andy Hoggan
Teh amount of silver on an immersion silver board won't effect 62/36/2 tin/lead/silver solder, however if the silver on the board is on the thick side and you have a high trace silver content in a 63/37 tin/lead then with the combination of the two y
Electronics Forum | Tue Mar 28 13:29:45 EST 2006 | solderiron
SN100C, not as aggressive towards other metals as are other High tin lead free alloys. Why? Sn63/pb37 The lead prevented the tin from being very aggressive. SAC305 no lead, silver instead. Silver doesnt block Tin from it's aggresiveness. SN100C no si
Electronics Forum | Wed Sep 29 19:47:44 EDT 2021 | emeto
"For the lead free soldering of electronic assemblies, the inclusion of silver in the alloy results in better wetting compared to non-silver containing alloys and also allows for a broader process window. Silver also improves joint reliab
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