Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken
ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.
Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef
Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit
Electronics Forum | Tue Oct 05 15:20:45 EDT 2010 | scottp
I agree that in consumer electronics there may be nothing wrong with using a lead free BGA in a SnPb process, but that blanket statement can't be made for the high reliability market.
Electronics Forum | Wed Aug 29 11:07:39 EDT 2007 | mikecollier
I am being asked to perform the same evaluation now with a Au/Pd termination varistor. We currently use a Pb/Sn process with an RMA flux. The manufacturer of the device recommends going to a 2% silver paste. What is the intended advantage with 2%
Electronics Forum | Wed Oct 06 12:45:01 EDT 2010 | blnorman
I've seen studies were Pb-free BGAs in a leaded process have no reliability issues when a lead free profile is used. Pb-free profile ensure proper ball collapse and solder joint formation.
Electronics Forum | Mon Dec 05 17:53:04 EST 2005 | KEN
I hate to sound like a broken record but the industry has been placing lead free through-hole parts forever. Now all of a sudden its a problem??? Gold finish, silver, silver paladium, alloy 42, even pure copper. Reliability will be a function of t
Electronics Forum | Thu Jan 25 04:55:08 EST 2007 | greg york
Strange as we have had huge problems with Silver in Many different Assembly houses. Mainly with Nitric Acid based Silvers causing blow holes, non wetting and even the Nitric etching away the tracks on fine boards. It has been one of the main problem
Electronics Forum | Tue Apr 13 22:48:11 EDT 2004 | Ken
I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviously not the case. It looks like you balls are almost pure tin (mp=238C) You are correct. This is exactly the same as using 10/90 high temp balls o
Electronics Forum | Thu Oct 31 12:37:37 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp
The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders
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